Technology Development Thin Film Process Engineer

United Microelectronics Corporation (UMC); Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

United Microelectronics Corporation (UMC) in Singapore is seeking a Process Engineer to advance semiconductor process development and yield improvements. You will work on bonding, deposition, and µ-bump technologies, collaborating across teams to drive efficiency and cost reduction.

Applicants should have a strong background in process development, troubleshooting, and cross-functional project leadership, with 2+ years in foundry environments and exposure to advanced nodes like 22/28 nm or below.

Qualifications

• Bachelor's degree in Electronic or related engineering.
• Minimum 2 years in semiconductor foundry process.
• Experience with 22/28 nm or smaller nodes is highly desirable.
• Strong process development, optimization and troubleshooting skills.
• Proven leadership in cross-functional project teams.
• Knowledge of SPC, 8D, DOE, FMEA and PMO is preferred.

Responsibilities

• Developing and optimizing W2W and C2W bonding/debonding processes.
• Evaluating carriers, mounting materials and related processes.
• Developing backside and wafer-bevel deposition processes.
• Developing µ-bump metallization processes (PVD and ECP).
• Defining process specs, running experiments, analyzing data and solving issues.
• Collaborating with cross-functional teams to improve performance and manufacturability.

Skills

Process development

Troubleshooting

Leadership

Cross-functional teamwork

Data analysis

DOE

FMEA

SPC

Education

Bachelor's Degree in Engineering

Job description

UMC is a leading global semiconductor foundry company. As a Process Engineer, you will develop your expertise in the semiconductor industry and improve conditions for advanced technologies through design and development experiments to provide more stable processes at lower cost and higher yield. You will establish a cooperative atmosphere with various manufacturers and engineers to jointly develop strategies and solutions to improve the company's efficiency.

Key responsibilities

• Developing and optimizing wafer-to-wafer (W2W) and chip-to-wafer (C2W) bonding and debonding processes.
• Evaluating and selecting suitable carriers, mounting materials, and associated processes.
• Developing backside and wafer-bevel film deposition processes.
• Developing micro-bump (µ-bump) metallization processes, including physical vapor deposition (PVD) and electrochemical plating (ECP).
• Defining process specifications, conducting experiments, analyzing data, and resolving process integration and yield issues.
• Collaborating with cross-functional teams to improve process performance, reliability, manufacturability, and production readiness.

About you

• Bachelor's Degree in Electronic Engineering, Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering or Physics
• Demonstrated experience of at least 2 years in semiconductor foundry module process
• 22/28 nanometer and below advance technology nodes experience is highly desirable
• Strong understanding of process development, optimization and troubleshooting
• Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer
• Ability to analyze complex process issues, identify root causes, and implement effective solutions
• Experience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred