Advanced Semiconductor Thin-Film Process Engineer

United Microelectronics Corporation (UMC); Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

United Microelectronics Corporation (UMC) in Singapore is seeking a Process Engineer to advance semiconductor process development and yield improvements. You will work on bonding, deposition, and µ-bump technologies, collaborating across teams to drive efficiency and cost reduction.

Applicants should have a strong background in process development, troubleshooting, and cross-functional project leadership, with 2+ years in foundry environments and exposure to advanced nodes like 22/28 nm or below.

Qualifications

• Bachelor's degree in Electronic or related engineering.
• Minimum 2 years in semiconductor foundry process.
• Experience with 22/28 nm or smaller nodes is highly desirable.
• Strong process development, optimization and troubleshooting skills.
• Proven leadership in cross-functional project teams.
• Knowledge of SPC, 8D, DOE, FMEA and PMO is preferred.

Responsibilities

• Developing and optimizing W2W and C2W bonding/debonding processes.
• Evaluating carriers, mounting materials and related processes.
• Developing backside and wafer-bevel deposition processes.
• Developing µ-bump metallization processes (PVD and ECP).
• Defining process specs, running experiments, analyzing data and solving issues.
• Collaborating with cross-functional teams to improve performance and manufacturability.

Skills

Process development

Troubleshooting

Leadership

Cross-functional teamwork

Data analysis

DOE

FMEA

SPC

Education

Bachelor's Degree in Engineering

Job description

United Microelectronics Corporation (UMC) in Singapore is seeking a Process Engineer to advance semiconductor process development and yield improvements. You will work on bonding, deposition, and µ-bump technologies, collaborating across teams to drive efficiency and cost reduction.

Applicants should have a strong background in process development, troubleshooting, and cross-functional project leadership, with 2+ years in foundry environments and exposure to advanced nodes like 22/28 nm or below.