Technology Development CMP Process Engineer

United Microelectronics Corporation (UMC); Singapore; On-site; SGD 50,000 - 90,000; Full time

Job summary

United Microelectronics Corporation (UMC) is seeking a Process Engineer to advance thinning processes (GRINDER, CMP) for chip-to-wafer integration, driving experiments to stabilize processes and reduce cost while increasing yield.

You will collaborate with cross-functional teams to improve process performance, reliability and production readiness, and apply techniques such as DOE, SPC and FMEA to analyze issues, optimize processes and transfer technology across lines.

Qualifications

• Bachelor's Degree in Electronic/Electrical/Electronic/Mechanical Engineering, Materials Science or Physics.
• Demonstrated experience of at least 2 years in semiconductor foundry module process.
• Experience with 22/28 nm and below technology nodes is highly desirable.
• Strong understanding of process development, optimization and troubleshooting.
• Proven leadership skills in leading cross-functional teams and managing projects.

Responsibilities

• Develop thinning process (GRINDER, CMP) for chip-to-wafer (C2W) with metrology.
• Define process specifications, conduct experiments, analyze data, and resolve process issues.
• Collaborate with cross-functional teams to improve process performance, reliability and production readiness.

Skills

Process development

Problem solving

Leadership

Education

Bachelor's Degree in Engineering

Tools

SPC

DOE

FMEA

Job description

UMC is a leading global semiconductor foundry company. As a Process Engineer, you will develop your expertise in the semiconductor industry and improve conditions for advanced technologies through design and development experiments to provide more stable processes at lower cost and higher yield. You will establish a cooperative atmosphere with various manufacturers and engineers to jointly develop strategies and solutions to improve the company's efficiency.

Key responsibilities

• Develop thinning process (GRINDER, CMP) for chip-to-wafer (C2W) which include metrology.
• Define process specifications, conduct experiments, analyze data, and resolve process integration and yield issues.
• Collaborate with cross-functional teams to improve process performance, reliability and production readiness.

About you

• Bachelor's Degree in Electronic Engineering, Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering or Physics
• Demonstrated experience of at least 2 years in semiconductor foundry module process
• 22/28 nanometer and below advance technology nodes experience is highly desirable
• Strong understanding of process development, optimization and troubleshooting
• Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer
• Ability to analyze complex process issues, identify root causes, and implement effective solutions
• Experience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred