CMP Process Engineer for 3D NAND Innovation

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; Vor Ort; SGD 110.000 - 160.000; Vollzeit

Zusammenfassung

Micron Singapore is seeking an Engineer - PD SG CMP to develop and optimize advanced Chemical Mechanical Planarization processes for next‑generation 3D NAND. You will work with global teams and suppliers to transition processes into high‑volume manufacturing and drive improvements in yield and efficiency.

The role requires a strong engineering background, analytical mindset, and collaborative communication in a fast-paced environment focused on innovation in memory technology.

Qualifikationen

• Bachelor’s degree in Engineering or related field.
• Proven experience in a similar engineering role with successful project implementation.
• Strong analytical and problem-solving skills.
• Excellent communication and collaboration abilities.
• Ability to work in a fast-paced, ambitious environment.
• Master’s degree in Engineering or related field (preferred).
• Experience with memory and storage technologies (preferred).
• Familiarity with advanced engineering tools and software (preferred).

Aufgaben

• Lead the development of CMP processes for advanced 3D NAND technologies.
• Characterize, optimize, and qualify CMP processes for future memory nodes.
• Coordinate with Singapore-based and international teams and suppliers.
• Transfer processes into manufacturing and drive yield, cost, and efficiency improvements.
• Troubleshoot process and manufacturing issues and develop effective solutions.
• Plan and execute experiments (DOE) to improve process capability.
• Evaluate consumables, hardware, and process technologies for future applications.
• Contribute to IP, patents, and technical papers.

Kenntnisse

Analytical thinking

Problem-solving

Communication skills

Collaboration

Fast-paced environment

Ausbildung

Bachelor's degree in Engineering or related field

Master’s degree in Engineering or related field (preferred)

Jobbeschreibung

Micron Singapore is seeking an Engineer - PD SG CMP to develop and optimize advanced Chemical Mechanical Planarization processes for next‑generation 3D NAND. You will work with global teams and suppliers to transition processes into high‑volume manufacturing and drive improvements in yield and efficiency.

The role requires a strong engineering background, analytical mindset, and collaborative communication in a fast-paced environment focused on innovation in memory technology.