Lead Process Engineer: 3D NAND & AI-Driven Innovation

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore

On-site

SGD 100,000 - 167,000

Full time

12 days ago

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Job summary

Micron's NAND Process Development (PD) Singapore group is seeking a Process Development Engineer to support rapid deployment and margin improvements across next‑gen 3D NAND nodes. The role involves developing CMP processes, coordinating with TD teams in Singapore and Boise, transferring processes to Fab10N, and driving continuous improvements with tool choices and manufacturability in mind.

You will apply advanced analysis, DoE, and AI-enabled methods to optimize yield, cost, and reliability,

Qualifications

  • PhD or Master’s ≥3 yrs, or Bachelor’s ≥5 yrs in a related field.
  • Experience with CMP polishing equipment (AMAT or EBARA).
  • Excellent problem-solving and critical decision making.
  • Strong data analysis skills (e.g., DoE, Y3).
  • Ability to collaborate with local and overseas teams on projects.
  • Excellent oral and written communication skills especially for remote communications.

Responsibilities

  • Develop and optimize CMP processes for 3D NAND and beyond.
  • Lead cross-functional teams on process development and optimization.
  • Transfer CMP processes to high volume manufacturing and drive manufacturability improvements.
  • Address process issues with Fab10N and tool-evaluation partners.
  • Identify process margins improvements and drive cost-reduction opportunities.
  • Apply AI-enabled methods to streamline workflows and data-driven decisions.

Skills

Problem solving
Critical thinking
Communication skills
Cross-functional collaboration
Data analysis

Education

PhD or Master’s ≥3 yrs or Bachelor’s ≥5 yrs in Materials Science/ Chemical Engineering/ Physics

Tools

AMAT CMP
EBARA CMP

Job description

Micron's NAND Process Development (PD) Singapore group is seeking a Process Development Engineer to support rapid deployment and margin improvements across next‑gen 3D NAND nodes. The role involves developing CMP processes, coordinating with TD teams in Singapore and Boise, transferring processes to Fab10N, and driving continuous improvements with tool choices and manufacturability in mind.

You will apply advanced analysis, DoE, and AI-enabled methods to optimize yield, cost, and reliability,

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