Back-End Process Engineer for NPI & Advanced Packaging

STMicro; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

STMicroelectronics is seeking an experienced engineer to drive and qualify back-end technology bricks for advanced Imaging Sensor packages from concept to mass production, collaborating with Process R&D, Manufacturing and Suppliers Management.

You will coordinate with cross-functional teams to solve bottlenecks, assess process changes, and ensure on-time execution while meeting sustainability and quality standards across SE Asia, Europe, and the USA.

Qualifications

• Bachelor/Master's degree in Engineering, Mechanical Engineering, Industrial Engineering, or Materials Science.
• Experience in CMOS image sensors or advanced packaging technology.
• Experience in IC or electronics industrialization from concept to volume production.
• Strong data analysis with JMP or MATLAB.
• Ability to work independently in multicultural teams.

Responsibilities

• Drive alignment among diverse stakeholders to meet business, technology, and operational goals.
• Coordinate back-end process technology development & qualification from concept to Mass Production ramp.
• Lead cross-functional teams with structured coordination and risk mitigation.

Skills

CMOS image sensors

Advanced packaging tech

IC/electronics industrialization

Multicultural teamwork

Stakeholder management

Data-driven decision making

Education

Bachelor/Master's in Engineering, Mechanical Engineering, Industrial Engineering, or Materials Science

Tools

JMP

MATLAB

Job description

STMicroelectronics is seeking an experienced engineer to drive and qualify back-end technology bricks for advanced Imaging Sensor packages from concept to mass production, collaborating with Process R&D, Manufacturing and Suppliers Management.

You will coordinate with cross-functional teams to solve bottlenecks, assess process changes, and ensure on-time execution while meeting sustainability and quality standards across SE Asia, Europe, and the USA.