Engineer, Back-end Operation

STMicro; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

STMicroelectronics is seeking an experienced engineer to drive and qualify back-end technology bricks for advanced Imaging Sensor packages from concept to mass production, collaborating with Process R&D, Manufacturing and Suppliers Management.

You will coordinate with cross-functional teams to solve bottlenecks, assess process changes, and ensure on-time execution while meeting sustainability and quality standards across SE Asia, Europe, and the USA.

Qualifications

• Bachelor/Master's degree in Engineering, Mechanical Engineering, Industrial Engineering, or Materials Science.
• Experience in CMOS image sensors or advanced packaging technology.
• Experience in IC or electronics industrialization from concept to volume production.
• Strong data analysis with JMP or MATLAB.
• Ability to work independently in multicultural teams.

Responsibilities

• Drive alignment among diverse stakeholders to meet business, technology, and operational goals.
• Coordinate back-end process technology development & qualification from concept to Mass Production ramp.
• Lead cross-functional teams with structured coordination and risk mitigation.

Skills

CMOS image sensors

Advanced packaging tech

IC/electronics industrialization

Multicultural teamwork

Stakeholder management

Data-driven decision making

Education

Bachelor/Master's in Engineering, Mechanical Engineering, Industrial Engineering, or Materials Science

Tools

JMP

MATLAB

Job description

OUR STORY

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

Job Summary

Drive & qualify new product introduction (NPI) with new back-end technology bricks for advanced Imaging Sensor package (Optical Module, Chip Scale Package) from early concept through high volume in collaboration with internal Process R&D, Manufacturing and Suppliers Management organization.

Coordinate & collaborate to solve complex technical bottlenecks in back-end technology process. Assess process changes & excursions supporting quality organization with internal and external customers.

It requires strong technical skills, solid stakeholder management and negotiation abilities, individual leadership and a multi-cultural approach. The role carries a high level of autonomy, accountability and decision-making skills together with the ability to lead complex international initiatives with a strong data driven mindset and influence stakeholders at multiple organizations levels.

Key focus includes technical gap assessment, Gross margin improvement & manufacturing performance to meet operations targets. On-time execution & technical issues solving to meet New Product Introduction milestones with full compliance on sustainability and quality requirement.

The Job requires flexibility to travel in South-East Asia (ST sites & Suppliers) & occasionally in Europe & USA.

Key responsibilities

• Drive alignment among diverse stakeholders (Package R&D, QMT, Quality, Planning, BU) to achieve common business, technology, and operational goals
• Coordinating Back-end process technology development & qualification from early concept to Mass Production ramp involving direct interactions with end customers.
• Drive execution with multiple teams through structured coordination, tight follow-up to ensure program alignment and risk mitigation.

Requirements

• Bachelor/Master's degree in Engineering, Mechanical Engineering, Industrial Engineering, or Materials Science
• Experience in CMOS image sensors or advanced packaging technology
• Experience in IC or electronics industrialization from early concept to volume production
• Established experience of technical issues solved to meet critical milestones with strong knowledge on key data software analysis such as JMP and MATLAB
• Able to work independently with minimal supervision and collaborate effectively in a multicultural team

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

To discover more, visit st.com/careers.