Applications Engineer – Semiconductor Packaging & Die Bonding

The Supreme HR Advisory Pte. Ltd.; Singapore; On-site; SGD 33,000 - 67,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. is seeking an experienced engineer to lead the design, development, and validation of software and hardware for advanced die bonding processes in Singapore.

You will analyze customer requirements and translate them into customized packaging solutions, focusing on process optimization and performance. Travel for customer support may be required; strong problem-solving and collaboration across R&D, software, and manufacturing are essential.

Qualifications

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies (Flip-Chip, PoP, wafer-level, panel-level bonding).
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving in a high-tech lab/manufacturing environment.
• Willingness to travel for customer support and on-site installations.

Responsibilities

• Lead design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions focusing on process optimization and performance.
• Conduct troubleshooting and failure analysis of die attach tools, process issues, and software anomalies; implement corrective actions to improve tool stability and reliability.
• Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation; maintain logs and reports.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address challenges and implement improvements.
• Provide on-site support for complex customer applications, including training for field application engineers and customers.
• Serve as interface between customers and R&D to deliver feedback for tool enhancements.

Education

Bachelor’s or Master’s degree in Engineering

Tools

Semiconductor equipment

Motion control systems

Job description

The Supreme HR Advisory Pte. Ltd. is seeking an experienced engineer to lead the design, development, and validation of software and hardware for advanced die bonding processes in Singapore.

You will analyze customer requirements and translate them into customized packaging solutions, focusing on process optimization and performance. Travel for customer support may be required; strong problem-solving and collaboration across R&D, software, and manufacturing are essential.