Application Engineer - Laser & Grinding Tech Support

DISCO HI-TEC (SINGAPORE) PTE LTD; Singapore; On-site; SGD 47,000 - 71,000; Full time

Job summary

DISCO HI-TEC (SINGAPORE) PTE LTD is seeking an engineering support professional to optimize customer applications and conduct in-house test cuts. You will coordinate with Japan-based engineers and provide on-site technical assistance.

The role emphasizes teamwork, proactive engagement, and strong customer relationship skills, with travel as needed and extension of hours to meet project demands.

Qualifications

• Diploma in Mechanical, Electronic, or related engineering discipline.
• 1–2 years of relevant experience, preferably in semiconductor environments.
• Strong MS Office skills (PowerPoint/Excel) and technical literacy.

Responsibilities

• Support process development activities to optimize customer applications
• Conduct in-house application test cuts and provide on-site customer technical support
• Manage and resolve customer claims related to abrasive products
• Communicate regularly with engineers from Japan to coordinate technical solutions
• Participate in company activities to foster team engagement
• Promote and maintain positive interdepartmental relationships
• Establish and sustain strong relationships with customers to ensure satisfaction and repeat business

Skills

Dicer/Grinder/Laser tech

Blades and wheels knowledge

MS Office (PowerPoint, Excel)

People & team oriented

Willing to travel / long hours

Education

Diploma in Mechanical or Electronic engineering

Tools

MS Office (PowerPoint, Excel)

Job description

DISCO HI-TEC (SINGAPORE) PTE LTD is seeking an engineering support professional to optimize customer applications and conduct in-house test cuts. You will coordinate with Japan-based engineers and provide on-site technical assistance.

The role emphasizes teamwork, proactive engagement, and strong customer relationship skills, with travel as needed and extension of hours to meet project demands.