Lead Engineer, Chip-on-Carrier Design & Assembly

Coherent Corp.; Stockholms kommun; On-site; SEK 1,000,000 - 1,250,000; Full time

Job summary

Coherent is seeking a Lead Engineer, Chip-on-Carrier Design & Assembly Processes to join our R&D team in Sweden. You will lead development of semiconductor and optoelectronic assembly processes and help transition technologies from R&D to pilot and early‑stage production.

You will work closely with development engineers, technicians, equipment suppliers, and manufacturing teams to ensure robust, scalable processes, wire bonding, die attach, and material considerations.

Qualifications

• Master's degree in a relevant technical discipline.
• 5–10 years of experience in photonics/optoelectronics/semiconductor packaging or related process development.
• Professional proficiency in English.

Responsibilities

• Lead hands-on development and optimization of wire bonding processes (wedge and ball bonding).
• Develop and optimize chip-on-carrier designs and assembly processes, including die attach technologies such as eutectic AuSn, SAC, flip-chip, and wire bonding.
• Drive process improvements to enhance performance, quality, yield, and reliability.
• Support the transition of technologies and processes from R&D to pilot and early-stage manufacturing.
• Collaborate with equipment suppliers regarding tooling, fixturing, and process optimization.
• Analyze process data, measurements, and test results to identify improvements and troubleshoot issues.
• Create and maintain technical documentation, work instructions, and process specifications.
• Provide technical expertise and support to development projects and cross-functional teams.
• Participate in laboratory and cleanroom activities related to device assembly and characterization.

Skills

English proficiency

Laboratory/cleanroom experience

Education

Master's degree in Engineering, Physics, Materials Science, Electronics, or a related technical discipline

Job description

Coherent is seeking a Lead Engineer, Chip-on-Carrier Design & Assembly Processes to join our R&D team in Sweden. You will lead development of semiconductor and optoelectronic assembly processes and help transition technologies from R&D to pilot and early‑stage production.

You will work closely with development engineers, technicians, equipment suppliers, and manufacturing teams to ensure robust, scalable processes, wire bonding, die attach, and material considerations.