Lead Engineer, Chip on Carrier Design and Assembly Processes

Coherent Corp.; Stockholms kommun; On-site; SEK 1,000,000 - 1,250,000; Full time

Job summary

Coherent is seeking a Lead Engineer, Chip-on-Carrier Design & Assembly Processes to join our R&D team in Sweden. You will lead development of semiconductor and optoelectronic assembly processes and help transition technologies from R&D to pilot and early‑stage production.

You will work closely with development engineers, technicians, equipment suppliers, and manufacturing teams to ensure robust, scalable processes, wire bonding, die attach, and material considerations.

Qualifications

• Master's degree in a relevant technical discipline.
• 5–10 years of experience in photonics/optoelectronics/semiconductor packaging or related process development.
• Professional proficiency in English.

Responsibilities

• Lead hands-on development and optimization of wire bonding processes (wedge and ball bonding).
• Develop and optimize chip-on-carrier designs and assembly processes, including die attach technologies such as eutectic AuSn, SAC, flip-chip, and wire bonding.
• Drive process improvements to enhance performance, quality, yield, and reliability.
• Support the transition of technologies and processes from R&D to pilot and early-stage manufacturing.
• Collaborate with equipment suppliers regarding tooling, fixturing, and process optimization.
• Analyze process data, measurements, and test results to identify improvements and troubleshoot issues.
• Create and maintain technical documentation, work instructions, and process specifications.
• Provide technical expertise and support to development projects and cross-functional teams.
• Participate in laboratory and cleanroom activities related to device assembly and characterization.

Skills

English proficiency

Laboratory/cleanroom experience

Education

Master's degree in Engineering, Physics, Materials Science, Electronics, or a related technical discipline

Job description

Location: Järfälla, Sweden

At Coherent, we are enabling the future of photonics and optoelectronics through innovation, advanced engineering, and world‑class manufacturing. We are now looking for a Lead Engineer, Chip-on-Carrier Design & Assembly Processes to join our R&D team and play a key role in developing next‑generation optoelectronic devices.

Job Description

Location: Järfälla, Sweden

At Coherent, we are enabling the future of photonics and optoelectronics through innovation, advanced engineering, and world‑class manufacturing. We are now looking for a Lead Engineer, Chip-on-Carrier Design & Assembly Processes to join our R&D team and play a key role in developing next‑generation optoelectronic devices.

This is a hands‑on engineering position for someone who enjoys working close to the technology, equipment, and manufacturing processes. You will be responsible for developing and optimizing chip‑on‑carrier assembly solutions and supporting the transition of new technologies from R&D into pilot and early‑stage production.

About The Role

As Lead Engineer, you will drive process development activities related to semiconductor and optoelectronic assembly technologies. You will work closely with development engineers, technicians, equipment suppliers, and manufacturing teams to ensure robust, scalable, and reliable assembly processes.

Key Focus Areas Include

• Wire bonding (gold wedge and ball bonding)
• Die bonding and die attach processes (including eutectic AuSn, SAC, and flip‑chip technologies)
• Vacuum reflow soldering
• Chip‑on‑carrier design and assembly optimization
• Process transfer from R&D to pilot manufacturing
• This role combines technical leadership with hands‑on laboratory and cleanroom work.

Key Responsibilities

• Lead hands‑on development and optimization of wire bonding processes (wedge and ball bonding).
• Develop and optimize chip‑on‑carrier designs and assembly processes, including die attach technologies such as eutectic AuSn, SAC, flip‑chip, and wire bonding.
• Drive process improvements to enhance performance, quality, yield, and reliability.
• Support the transition of technologies and processes from R&D to pilot and early‑stage manufacturing.
• Collaborate with equipment suppliers regarding tooling, fixturing, and process optimization.
• Analyze process data, measurements, and test results to identify improvements and troubleshoot issues.
• Create and maintain technical documentation, work instructions, and process specifications.
• Provide technical expertise and support to development projects and cross‑functional teams.
• Participate in laboratory and cleanroom activities related to device assembly and characterization.

What You Bring

We are looking for a technically strong and practical engineer who enjoys solving complex manufacturing and assembly challenges.

Required Qualifications

• Master's degree in Engineering, Physics, Materials Science, Electronics, or a related technical discipline.
• 5–10 years of experience in photonics, optoelectronics, semiconductor packaging, or related process development.
• Experience working with semiconductor assembly processes.
• Strong hands‑on experience in laboratory and/or cleanroom environments.
• Professional proficiency in English.

Preferred Qualifications

• Experience with wire bonding (wedge and/or ball bonding).
• Experience with die bonding technologies, including eutectic AuSn, SAC, and flip‑chip processes.
• Experience with vacuum reflow soldering using materials such as AuSn, SAC, or indium.
• Knowledge of semiconductor back‑end processes and micro‑assembly techniques.
• Experience working with assembly tools, equipment, fixtures, and process optimization.
• Swedish language skills are considered an advantage but are not required.

Who You Are

You are a curious and solution‑oriented engineer who enjoys being close to the technology. You are comfortable balancing development work with practical execution and thrive in a collaborative environment where innovation and continuous improvement are valued.

You take ownership of your work, communicate effectively with stakeholders, and are motivated by seeing your ideas transition into real products and manufacturing solutions.

Why Join Coherent?

At Coherent, you will work with cutting‑edge photonics technologies alongside highly skilled colleagues in an international environment. You will have the opportunity to influence future products, develop advanced manufacturing processes, and contribute directly to innovations that make a difference across a wide range of industries.

We look forward to hearing from you!

About Us

Coherent is a global leader in lasers, engineered materials and networking components. We are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard‑work through a competitive compensation program. It's an exciting opportunity to work for a company that offers stability, longevity and growth. Come Join Us!