Staff Assembly Engineer

Navitas Semiconductor; Muntinlupa; On-site; PHP 600,000 - 1,200,000; Full time

Job summary

Navitas Semiconductor in the Philippines seeks a process engineer to lead assembly-related NPI activities with subcontractors, focusing on risk evaluation and on-site execution with global teams.

You will review specs, coordinate tooling and BOM improvements, and drive issue resolution for quality and yield while participating in cross-functional meetings to ensure smooth mass production.

Experience with FMEA, SPC, DOE and related tools, plus fluent English, is required.

Qualifications

• Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering, or related majors.
• Must be fluent in English in writing and speaking.
• Must have at least 5 years process engineering experience in a semiconductor backend facility.
• Experienced with Wafer Saw, Laser Groove or DB or WB or EOL Assy; broad assembly knowledge is a plus.
• Experienced with Engineering Problem Solving Tools like FMEA, SPC, Control plan, OCAP, 8D, MSA; DOE expertise is advantageous.

Responsibilities

• Work with subcontractors on Assembly Processes Characterization and risk-based evaluation; manage execution and closure.
• Review or generate process specs and obtain cross-team approvals.
• Collaborate with subcontractors to design and improve leadframe and BOM.
• Coordinate NRE tooling quotes, PO releases, and deliveries with subcontractors.
• Manage risks for NPI assembly, monitor on-site progress for critical builds.
• Support investigation and resolution of quality, yield, and customer returns; perform daily sustaining to maintain production.

Skills

Process engineering

NPI management

Risk assessment

Project management

Quality investigation

Education

Bachelor's degree in Mechanical Automation

Bachelor's degree in Electrical Engineering

Tools

FMEA

SPC

Control plan

8D

MSA

DOE

Job description

• Work with subcontractors on Assembly Processes Characterization. Risk base review on New Product/Package Introduced and create evaluation based on the risk identified. Will follow thru execution and closure.
• Review or generate Process specs and other documents, follow up review and approval by different teams within the organization.
• Work with Subcontractors in designing and improving leadframe, BOM.
• Work with Subcontractors on NRE tooling quote, PO release and delivery.
• Manage and prevent risks in running NPI products in assembly, closely monitor and on-site follow up on critical NPI builds.
• Support investigation and resolution of quality, yield and customer return issue. Daily sustaining to smooth the normal production.
• Regular online meeting with cross functional team (NPI, Delivery, Quality and Customer related).
• Lead overall execution locally at Subcon side together with global team.
• Use Project management tool is an advantage to manage NPI activities in subcon from process characterization to assembling Qualification lots to Mass Production Release.

Key Responsibilities And Duties

• Work with subcontractors on Assembly Processes Characterization. Risk base review on New Product/Package Introduced and create evaluation based on the risk identified. Will follow thru execution and closure.
• Review or generate Process specs and other documents, follow up review and approval by different teams within the organization.
• Work with Subcontractors in designing and improving leadframe, BOM.
• Work with Subcontractors on NRE tooling quote, PO release and delivery.
• Manage and prevent risks in running NPI products in assembly, closely monitor and on-site follow up on critical NPI builds.
• Support investigation and resolution of quality, yield and customer return issue. Daily sustaining to smooth the normal production.
• Regular online meeting with cross functional team (NPI, Delivery, Quality and Customer related).
• Lead overall execution locally at Subcon side together with global team.
• Use Project management tool is an advantage to manage NPI activities in subcon from process characterization to assembling Qualification lots to Mass Production Release.

Qualifications

Required Qualifications

Basic

• Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering, or related majors.
• Must be fluent in English in writing and speaking.
• Must have at least 5 years process engineering experience in a Semiconductor backend facility.
• Experienced with Wafer Saw, Laser Groove or DB or WB or EOL Assy. Advantage to have average understanding in the whole Assembly Process.
• Experienced with Engineering Problem Solving Tool like FMEA, SPC, Control plan, OCAP, 8D, MSA. Advantage on expert user on DOE.

Preferred

• Experienced in the whole Assembly Process (from Dicing to Singulation & Tape and Reel)