Sr. Engineer, NTI/NPI in Back-End Technology (R&D)

Ampleon; Cabuyao; On-site; PHP 1,200,000 - 1,800,000; Full time

Job summary

Ampleon in the Philippines seeks a Senior NTI/NPI Engineer to lead new technology and product introductions for assembly interconnect processes. The role focuses on pre-development and development activities within back-end technology, coordinating cross-functional teams to ensure scalable high-volume readiness.

The ideal candidate has strong project management experience in electronics manufacturing, plus hands-on knowledge of RF interconnect, wire bonding, SMT, and related processes.

Qualifications

• Bachelor's degree in Electronics Engineering, Electrical Engineering, Industrial Engineering, Manufacturing Engineering, or a related field.
• Experience in project management within electronics manufacturing, semiconductor packaging
• Strong understanding of RF product assembly processes, SMT, die attach, wire bonding, soldering, testing, and manufacturing operations (is a must)
• Knowledge of project management methodologies and tools. (PCP)
• Strong leadership, organizational, communication, and problem-solving skills.
• PMP, CAPM, Agile, or other project management certification is a plus
• Familiarity with Lean Manufacturing, Six Sigma, APQP, PFMEA, SPC, and Process Validation methodologies.

Responsibilities

• You will be the Sr. Engineer, NTI/NPI in Back-End Technology where you will lead and manage new technology, platform, and product introduction, either pre-development and/or development for Assembly Process focused on interconnect.
• Develop new interconnect processes to support new products/packages to create new business opportunities.
• Evaluate, qualify, and introduce new process/methodology though DoE definition, in compliance with the design rules and release procedures to ensure that the product is ready for high volume production.
• Participate in establishing design rules and process roadmaps.
• Develop new tooling and define breakthrough procedures which would improve process development cycle time/efficiency.
• Provide day-to-day package/process support requirements focused on cost reduction and efficiency improvement.
• Coordinate with manufacturing/QA/process engineers and support teams to release new packages/products and transfer projects smoothly.
• Preparing and reviewing Risk Assessment (DFMEA), Design for Manufacturing (DfM) and Control Plan for NTI/NPI releases.

Skills

Leadership

Project management

Communication

Problem-solving

Education

Bachelor's degree in Electronics Engineering, Electrical Engineering, Industrial Engineering, Manufacturing Engineering

Tools

PCP

APQP

PFMEA

SPC

Job description

• Bachelor's degree in Electronics Engineering, Electrical Engineering, Industrial Engineering, Manufacturing Engineering, or a related field.


• Experience in project management within electronics manufacturing, semiconductor packaging,


• Strong understanding of RF product assembly processes, SMT, die attach, wire bonding, soldering, testing, and manufacturing operations (is a must)


• Knowledge of project management methodologies and tools. (PCP)


• Strong leadership, organizational, communication, and problem-solving skills.


• PMP, CAPM, Agile, or other project management certification is a plus


• Familiarity with Lean Manufacturing, Six Sigma, APQP, PFMEA, SPC, and Process Validation methodologies.

You will be the Sr. Engineer, NTI/NPI in Back-End Technology where you will lead and manage new technology, platform, and product introduction, either pre-development and/or development for Assembly Process focused on interconnect.

• Technical expertise: Assembly – preferably with knowledge in interconnect (any of the following; having multiple competences in interconnect is a plus): Wirebond (Au/Al/Cu)/Flip Chip/Clip Bond/Ribbon/Sinter/SMT etc.


• Application of project management approach in development such as PCP or APQP or equivalent.


• Responsible for developing new interconnect processes to support new products/packages to create new business opportunities.


• Evaluate, qualify, and introduce new process/methodology though DoE definition, in compliance with the design rules and release procedures to ensure that the product is ready for high volume production.


• Participate in establishing design rules and process roadmaps.


• Develop new tooling and define breakthrough procedures which would improve process development cycle time/efficiency.


• Provide day-to-day package/process support requirements focused on cost reduction and efficiency improvement.


• Coordinate with manufacturing/QA/process engineers and support teams to release new packages/products and transfer projects smoothly.


• Preparing and reviewing Risk Assessment (DFMEA), Design for Manufacturing (DfM) and Control Plan for NTI/NPI releases.