Senior Process Engineer, Electronics Packaging & Reliability

FHLB Des Moines; Hinoba-an; On-site; PHP 400,000 - 700,000; Full time

Job summary

Microchip Technology Inc. in the Philippines is seeking a seasoned engineering professional to join our QA/Manufacturing team and help sustain high-performance production lines.

You will apply DOE, SPC and FMEA concepts, work with QFN packaging, Die Attach processes (AD832i/AD8312 Plus), wirebonding, plasma steps, and line sustenance to ensure reliability. Excellent communication, team spirit, and project-management ability are highly valued as we drive continuous improvement.

Qualifications

• Graduate in any engineering discipline.
• Minimum 5 years in related field.
• Good communication and teamwork.

Responsibilities

• Knowledgeable in QFN packaging operations.
• Experience with Die Attach AD832i and AD8312 Plus.
• Familiar with DOE, SPC, FMEA and control plan.
• Experience with Wirebond ASM Twin Aero.
• Experience with plasma process and line sustaining.

Skills

QFN package

Die Attach experience

DOE & FMEA

Wirebond experience

Plasma process

Line sustaining

Engineering analysis

Communication skills

Materials reliability

PM experience

Education

Engineering degree

Job description

Microchip Technology Inc. in the Philippines is seeking a seasoned engineering professional to join our QA/Manufacturing team and help sustain high-performance production lines.

You will apply DOE, SPC and FMEA concepts, work with QFN packaging, Die Attach processes (AD832i/AD8312 Plus), wirebonding, plasma steps, and line sustenance to ensure reliability. Excellent communication, team spirit, and project-management ability are highly valued as we drive continuous improvement.