NPI Engineering Lead - External Manufacturing

onsemi; Carmona; On-site; PHP 1,200,000 - 1,800,000; Full time

Job summary

onsemi is seeking an External Manufacturing NPI Lead to drive backend NPI programs from concept to production launch. The role involves leading cross-functional teams, coordinating with OSATs, and ensuring DFM readiness for new package platforms.

You will guide qualification activities, manage ramp plans, and apply data-driven approaches to optimize yield and process improvements. The ideal candidate has 10+ years in backend semiconductor manufacturing, strong leadership, and experience in NPI,

Qualifications

• Bachelor's Degree in Engineering/Materials Science or equivalent technical background.
• More than 10 years of experience in backend semiconductor IC manufacturing with assembly process expertise.
• Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings.
• Hands-on assembly process experience in wafer technology such as SiC, GaN and CIS Imaging is highly desirable.
• Prior experience in NPI, product/process integration and familiar with Chip-to-Package Interaction (CPI) effect.
• Experience in IC package design/CAD/simulation/characterization will be advantageous.
• Good overall understanding of OSAT business landscape and operations.
• Adept at cross-functional collaboration, adaptable to matrix organization, strong engineering fundamentals and problem-solving skills.
• Strong PM skills and multi-stakeholder management.
• Proficient in statistical analysis methods and data analytics.
• Good communication skills and English proficiency; Mandarin helpful.

Responsibilities

• Own backend external manufacturing NPI from conceptualization, development, qualification to production launch.
• Lead Functional Leadership for NPI to deliver PLM requirements for new product commercialization and cross-functional collaboration for on-time market release.
• Interface and steer cross-functional engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement.
• Drive DFM and manufacturability readiness for new package and complex derivative platforms for production readiness.
• Partner with OSATs to deliver assembly readiness for new product qualification including BOM, risk analysis, qualification and CAB preparation.
• Manage production ramp: lead safe launch, resolve ramp issues, develop CIP, set baseline for transition to high-volume manufacturing.
• Collaborate with internal and external partners for technology pathfinding and design-rule development.
• Adopt data analytics and data-driven problem solving and decision making.
• Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform production.
• Participate in quality and process readiness audits to ensure site readiness.
• Collaborate with operations to improve yield; address evolving challenges.
• Serve as subject matter expert on package and assembly challenges.
• Potential to lead a 5–6 person team for delivery, planning, and execution.

Skills

Leadership

PM skills

Cross-functional collaboration

Data analytics

Statistical analysis

Problem solving

DOE characterization

Failure analysis

Education

Bachelor's Degree in Engineering/ Materials Science

Tools

CAD

Simulation

Characterization

Job description

onsemi is seeking an External Manufacturing NPI Lead to drive backend NPI programs from concept to production launch. The role involves leading cross-functional teams, coordinating with OSATs, and ensuring DFM readiness for new package platforms.

You will guide qualification activities, manage ramp plans, and apply data-driven approaches to optimize yield and process improvements. The ideal candidate has 10+ years in backend semiconductor manufacturing, strong leadership, and experience in NPI,