External Manufacturing NPI Engineer

onsemi; Carmona; On-site; PHP 1,200,000 - 1,800,000; Full time

Job summary

onsemi is seeking an External Manufacturing NPI Lead to drive backend NPI programs from concept to production launch. The role involves leading cross-functional teams, coordinating with OSATs, and ensuring DFM readiness for new package platforms.

You will guide qualification activities, manage ramp plans, and apply data-driven approaches to optimize yield and process improvements. The ideal candidate has 10+ years in backend semiconductor manufacturing, strong leadership, and experience in NPI,

Qualifications

• Bachelor's Degree in Engineering/Materials Science or equivalent technical background.
• More than 10 years of experience in backend semiconductor IC manufacturing with assembly process expertise.
• Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings.
• Hands-on assembly process experience in wafer technology such as SiC, GaN and CIS Imaging is highly desirable.
• Prior experience in NPI, product/process integration and familiar with Chip-to-Package Interaction (CPI) effect.
• Experience in IC package design/CAD/simulation/characterization will be advantageous.
• Good overall understanding of OSAT business landscape and operations.
• Adept at cross-functional collaboration, adaptable to matrix organization, strong engineering fundamentals and problem-solving skills.
• Strong PM skills and multi-stakeholder management.
• Proficient in statistical analysis methods and data analytics.
• Good communication skills and English proficiency; Mandarin helpful.

Responsibilities

• Own backend external manufacturing NPI from conceptualization, development, qualification to production launch.
• Lead Functional Leadership for NPI to deliver PLM requirements for new product commercialization and cross-functional collaboration for on-time market release.
• Interface and steer cross-functional engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement.
• Drive DFM and manufacturability readiness for new package and complex derivative platforms for production readiness.
• Partner with OSATs to deliver assembly readiness for new product qualification including BOM, risk analysis, qualification and CAB preparation.
• Manage production ramp: lead safe launch, resolve ramp issues, develop CIP, set baseline for transition to high-volume manufacturing.
• Collaborate with internal and external partners for technology pathfinding and design-rule development.
• Adopt data analytics and data-driven problem solving and decision making.
• Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform production.
• Participate in quality and process readiness audits to ensure site readiness.
• Collaborate with operations to improve yield; address evolving challenges.
• Serve as subject matter expert on package and assembly challenges.
• Potential to lead a 5–6 person team for delivery, planning, and execution.

Skills

Leadership

PM skills

Cross-functional collaboration

Data analytics

Statistical analysis

Problem solving

DOE characterization

Failure analysis

Education

Bachelor's Degree in Engineering/ Materials Science

Tools

CAD

Simulation

Characterization

Job description

• Own backend external manufacturing NPI from conceptualization, development, qualification to production launch
• Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
• Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives
• Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization
• Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
• Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
• Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
• Adoption of data analytics and data-driven approach to problem solving and decision making
• Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
• Participate in quality and process readiness audit to achieve production site readiness
• Co-work with operations to drive continuous yield improvement for evolving challenges
• Subject Matter Expert to address arising package and assembly challenges
• Experienced candidate(s) will be considered for technical lead role to manage team (5-6 person) team’s performance including overall delivery, tactical, resource planning & execution

Job Description

External Manufacturing NPI Lead

Responsibilities

• Own backend external manufacturing NPI from conceptualization, development, qualification to production launch
• Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
• Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives
• Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization
• Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
• Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
• Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
• Adoption of data analytics and data-driven approach to problem solving and decision making
• Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
• Participate in quality and process readiness audit to achieve production site readiness
• Co-work with operations to drive continuous yield improvement for evolving challenges
• Subject Matter Expert to address arising package and assembly challenges
• Experienced candidate(s) will be considered for technical lead role to manage team (5-6 person) team’s performance including overall delivery, tactical, resource planning & execution

Qualifications

• Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
• More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
• Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings
• Hands‑on assembly process experience in leading wafer technology such as SiC, GaN and CIS Imaging is highly desirable
• Prior experience in NPI, product/ process integration and familiar with Chip‑to‑Package Interaction (CPI) effect
• Experience in IC package design/ CAD/ simulation/ characterization will be advantageous
• Good overall understanding of OSAT business landscape and operations
• Adept at cross‑functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem‑solving skills
• Strong project management skills and multi‑stakeholder management
• Proficient in statistical analysis methods and familiar with data analytics
• Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.