Lead Engineer, Package Development

Allegro Microsystems Philippines Inc.; Parañaque; On-site; PHP 1,200,000 - 1,800,000; Full time

Job summary

Allegro Microsystems Philippines Inc. is seeking a Lead Engineer for Package Development with extensive experience in semiconductor packaging. The role focuses on defining test strategies, leading validation, and driving yield improvements for new products from design to production.

Autonomy and cross-functional collaboration are key to on-time releases and profitability. The candidate will oversee process/material development, equipment qualification, and cost reduction, while coordinating with

Qualifications

• 5+ years’ experience in Package Development, NPI or Sustaining role in semiconductor assembly for leadframe and substrate-based packages.
• Comprehensively perform, review and interpret mold simulations and create/recommend effective solutions to achieve optimum results.
• Review POD and tooling designs and create/recommend effective solutions to achieve design intent.
• Comprehensive knowledge of downstream and upstream Assembly processes that impact the Molding Processes and can be impacted by molding output.
• SME level knowledge on FA/Rel Assessment instruments namely CSAM, Cross Section, SEM and similar methods/tools.
• Knowledge of Design for Manufacturability, DFMEA and DRBFM or equivalent.
• Statistical methods of experimentation and their application/tools (DOE, SAS-JMP, Minitab) to improve Process and Equipment Capability.
• Knowledge and application of Core tools: Process Flow, FMEA, Control Plan, Process Specifications and Work Instructions.
• Strong communication, presentation, and training skills.

Responsibilities

• Lead process/material/product development to support new packaging projects.
• Optimize process parameters to improve yield and manufacturability.
• Source and test alternative materials to reduce costs and improve quality.
• Design and qualify jigs, fixtures, and tools to enhance machine efficiency.
• Develop cost reduction and yield improvement plans with PD and NPI teams.
• Coordinate documentation and standards for new package projects.
• Coordinate quality, manufacturability and reliability issues with customers and suppliers.
• Drive on-time product release and profitability.

Skills

Leadership

Communication skills

Training skills

People management

Education

Degree in Mechanical/Electrical / Electronics and Communication /Materials / Metallurgical / Chemical / Manufacturing / Industrial Engineering

Tools

DOE

SAS-JMP

Minitab

Job description

The Allegro team is united by a clear purpose - advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business - from breakthrough product development and customer success to how we show up for each other and the communities we serve.

The Opportunity

The Lead Engineer for Package Development is an experienced professional who takes a leading role in bringing new products from design to production. This role is responsible for defining test strategies, leading validation efforts, and driving yield improvement for complex products. Operating with a high degree of autonomy, the Lead Engineer for Package Development is a key contributor to on-time product release and profitability.

What You Will Do:

Process/Material/Product Development

Process Parameter Optimization

• Recommend alternative materials to reduce costs, enhance quality, and improve manufacturability.
• Support on material characterization
• Execute appropriate analysis (Destructive Package Analysis, Failure Analysis, Product Characterization) to aid in in the design and/or resolution of issues for new packaging projects.
  

Improvement of Existing Methods and Conception of New Methods

• Conceives, sources out and tests alternative and new methods/processes to improve manufacturability, yield, and quality.
• Spearheads generation of FMEA for new Assembly processes and reviews until completion of qualification.

Equipment Qualification and Development

• Designs and/or qualifies jigs, fixtures, and tools to enhance machine efficiency and improve product quality.
• Generates and/or reviews equipment specifications and qualification procedures and supporting documents for PAR of new equipment.
• Spearheads machine qualification and monitoring, and/or conducts equipment buy-off at supplier site. Recommends machine modifications whenever necessary.

Material Development

• Sources out, evaluates and recommends alternative materials to reduce cost, enhance quality, and improve manufacturability.

Product Development

• Determines machine and process capability for new products.
• Ensures that engineering lots for new devices and packages are assembled in conformance to all requirements and process concerns are reported.

Cost Reduction and Yield Improvement

• Plans, designs, implements and monitors activities geared to improve product and material yield, reduce production cost and/or reduce product reliability defects.
• Work with PD and NPI on developing strategies for new products.

Standardization and Documentation

• Generates, interprets, and updates process and material specifications and flowcharts for new package projects.
• Interprets quality inspection criteria and specifications.
• Prepares technical reports on the results of evaluations and investigations and presents recommended actions.

Coordination/Communication of Process Issues for Improved Quality, Manufacturability and Reliability.

• Coordinates quality, manufacturability, process control and reliability issues with internal and external customers.
• Facilitates discussion of material and equipment quality and performance issues with supplier/s.

What You Will Need:

• Degree in Mechanical/Electrical / Electronics and Communication /Materials / Metallurgical / Chemical / Manufacturing / Industrial Engineering.
• Subject matter expert with at least 5 years’ experience in a Package Development, New Product Introduction and/or Sustaining role in a semiconductor assembly environment for leadframe and substrate-based packages, including failure modes and failure analysis, covering standard and custom package.
• Comprehensively perform, review and interpret mold simulations and create/recommend effective solutions to achieve optimum results.
• Review and interpret POD and tooling designs and create/recommend effective solutions to achieve design intent.
• Comprehensive knowledge of downstream and upstream Assembly processes that impact the Molding Processes) and can be impacted by the output of the Molding Process, respectively.
• Comprehensive or SME level knowledge on FA/Rel Assessment instruments namely CSAM, Cross Section, SEM and similar methods/tools.
• Comprehensive use of principles of Design for Manufacturability, DFMEA and Design Review for Manufacturability by Failure Modes (DRBFM) or its equivalent.
• Subject matter expert in the use of statistical methods of experimentation and analysis and their associated application/tools (DOE, SAS-JMP, Minitab, others) to establish and improve Process and Equipment Capability.
• Comprehensive knowledge and application of the Advance Quality Core tools (Process Flow, FMEA, Control Plan, Process Specifications and Work Instructions)
• Comprehensive knowledge and application of Problem-Solving Methods and use of the appropriate analytical techniques to establish cost effective and efficient solutions with high level of critical thinking with solution provider mindset.
• High level of effective written, oral communication, presentation, and training skills.
• High aptitude in mechanical reasoning and drawing with comprehensive knowledge of dimensioning and tolerancing.
• Comprehensive use of Continuous Improvement Tools like PDCA, Lean, others.
• Experience in handling, supervising a technical team and possesses good people skills.

Why Allegro?

Join Allegro and become part of a team where your contributions truly matter.

We foster a culture of Real Innovation, empowering you to push boundaries, develop cutting-edge solutions, and drive continuous improvement.
Your work will create a Real Impact by solving complex real-world challenges that fuel our success and shape the future of technology.
You’ll experience Real Connection, collaborating with talented colleagues around the globe in an environment built on trust, respect, and a shared purpose.
Join us - help build what’s next.