Engineer I Process_Grinding and Lamination

HVAC Total FM Recruitment; Philippines; On-site; PHP 1,052,000 - 1,823,000; Full time

Job summary

Microchip Technology Inc. seeks an Engineer I-Process – Backgrind to develop and qualify wafer thinning technologies for advanced packaging platforms.

You will lead backgrind process development, drive technology innovation, and collaborate with Product Development, R&D, Equipment Engineering, Operations, and Quality to ensure manufacturability and reliability. The role focuses on robust backgrinding, wafer thinning, stress management, and handling processes, enabling high yield and

Qualifications

• Bachelor's degree in Electronics Engineering or related field.
• 3+ years in semiconductor manufacturing with backgrinding and tape lamination experience.
• Experience with DOE, Minitab/JMP, SPC, FMEA, GRR and Six Sigma tools.
• Familiar with process characterization, recipe creation, and troubleshooting.
• Strong analytical and problem-solving skills; ability to interpret SPC charts.
• Good communication and teamwork; safety and cleanroom knowledge.
• Preferred experience with Fan-in/Fan-Out or advanced packaging tools.

Responsibilities

• Lead development and qualification of wafer backgrinding and thinning processes.
• Establish process architecture, windows, and roadmaps for wafer thinning applications.
• Drive innovations for thinner wafers and improved wafer integrity.
• Evaluate new grinding technologies, materials, and equipment solutions.
• Develop best practices and standards for wafer thinning and handling operations.
• Define process architecture, flow, and critical parameters for reliability and manufacturability.
• Lead process characterization to establish robust operating windows and margins.
• Transfer processes from development to pilot and high-volume manufacturing.
• Generate process specifications, control plans, and qualification reports.
• Support ramp and early production phases and drive continuous improvement.

Skills

DOE

Minitab/JMP

SPC

FMEA

GRR

Six Sigma

Analytical skills

Education

Bachelor's in Electronics Engineering or related

Tools

Minitab

JMP

Six Sigma tools

Job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you. Visit our careers page to see what exciting opportunities and company perks await!

Job Description

The Engineer I-Process – Backgrind is responsible for the development, characterization, qualification, and industrialization of wafer thinning technologies supporting advanced semiconductor packaging platforms including WLCSP, BGA, MDQFN, Fan-Out, and other wafer-level packaging technologies. The role focuses on developing robust backgrinding, wafer thinning, stress management, and wafer handling processes that enable high-yield, reliable, and manufacturable products. The position serves as the technical lead for Backgrind process development activities, driving technology innovation, new product introduction (NPI), process optimization, and manufacturing readiness while collaborating with Product Development, R&D, Equipment Engineering, Operations, Quality, and external suppliers.

Job Responsibilities

• Lead the development and qualification of wafer backgrinding and thinning processes for new technology platforms and products.
• Establish process architecture, process windows, and technology roadmaps for wafer thinning applications.
• Drive innovation initiatives to enable thinner wafers, improved wafer integrity, and advanced package requirements.
• Evaluate and implement new grinding technologies, materials, consumables, and equipment solutions.
• Develop best practices and standards for wafer thinning and handling operations
• Define process architecture, process flow, and critical process parameters to meet design, reliability, and manufacturability requirements.
• Lead process characterization activities to establish robust operating windows and process margins.
• Evaluate emerging technologies, materials, and equipment to enhance technical capabilities and competitive advantage.
• Drive innovation initiatives to improve metallization performance, process capability, throughput, and cost effectiveness.
• Lead process transfer from development to pilot and high-volume manufacturing.
• Generate process specifications, control plans, operating procedures, and qualification reports.
• Ensure developed processes meet manufacturability, reliability, and cost targets.
• Support manufacturing teams during technology ramp and early production phases.
• Drive process stabilization and continuous improvement following production release.
• Serve as Subject Matter Expert (SME) for: Wafer and Panel Backgrinding Top mold grinding Coarse and Fine Grinding Wafer Thinning Technologies Temporary Wafer Mounting Systems Grinding Wheel Technologies Wafer or Panel Handling and Transport Wafer or Panel Warpage Management Thin Wafer Processing Tape Lamination, Detaping and Cure Processes

Requirements

• Bachelor's Degree in Electronics Engineering, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, Semiconductor Engineering, Physics, Related Engineering disciplines
• Minimum 3 years of semiconductor manufacturing experience with direct experience in Backgrinding and Tape Lamination process
• Engineering tools: Design of Experiment (DOE), Minitab or JMP, Statistical Process Control (SPC), FMEA, GRR and Six Sigma tools
• Familiarity with process characterization, recipe creation, and equipment or process troubleshooting
• Strong analytical and problem-solving skills; ability to interpret SPC charts and process data.
• Good communication skills and ability to work in a team-oriented environment.
• Knowledge of safety protocols and cleanroom practices.
• Strong experience with Fan-in and Fan-Out or advanced packaging tools is highly preferred
• Proficiency in MS Office and maintenance management systems.
• Strong analytical and problem-solving skills Leadership and mentoring capability
• Good communication and teamwork skills
• High attention to detail and sense of accountability

Travel Time: 0% - 25%