Wafer Backgrind Engineer I: Process Innovation & Yield

HVAC Total FM Recruitment; Philippines; On-site; PHP 1,052,000 - 1,823,000; Full time

Job summary

Microchip Technology Inc. seeks an Engineer I-Process – Backgrind to develop and qualify wafer thinning technologies for advanced packaging platforms.

You will lead backgrind process development, drive technology innovation, and collaborate with Product Development, R&D, Equipment Engineering, Operations, and Quality to ensure manufacturability and reliability. The role focuses on robust backgrinding, wafer thinning, stress management, and handling processes, enabling high yield and

Qualifications

• Bachelor's degree in Electronics Engineering or related field.
• 3+ years in semiconductor manufacturing with backgrinding and tape lamination experience.
• Experience with DOE, Minitab/JMP, SPC, FMEA, GRR and Six Sigma tools.
• Familiar with process characterization, recipe creation, and troubleshooting.
• Strong analytical and problem-solving skills; ability to interpret SPC charts.
• Good communication and teamwork; safety and cleanroom knowledge.
• Preferred experience with Fan-in/Fan-Out or advanced packaging tools.

Responsibilities

• Lead development and qualification of wafer backgrinding and thinning processes.
• Establish process architecture, windows, and roadmaps for wafer thinning applications.
• Drive innovations for thinner wafers and improved wafer integrity.
• Evaluate new grinding technologies, materials, and equipment solutions.
• Develop best practices and standards for wafer thinning and handling operations.
• Define process architecture, flow, and critical parameters for reliability and manufacturability.
• Lead process characterization to establish robust operating windows and margins.
• Transfer processes from development to pilot and high-volume manufacturing.
• Generate process specifications, control plans, and qualification reports.
• Support ramp and early production phases and drive continuous improvement.

Skills

DOE

Minitab/JMP

SPC

FMEA

GRR

Six Sigma

Analytical skills

Education

Bachelor's in Electronics Engineering or related

Tools

Minitab

JMP

Six Sigma tools

Job description

Microchip Technology Inc. seeks an Engineer I-Process – Backgrind to develop and qualify wafer thinning technologies for advanced packaging platforms.

You will lead backgrind process development, drive technology innovation, and collaborate with Product Development, R&D, Equipment Engineering, Operations, and Quality to ensure manufacturability and reliability. The role focuses on robust backgrinding, wafer thinning, stress management, and handling processes, enabling high yield and