Senior 2.5D/3D Packaging & Power Delivery Architect

Axelera AI; Amsterdam; Remote; EUR 120,000 - 180,000; Full time

Benefits offered by this job

Pension plan

Extensive employee insurances

Company shares

Job summary

Axelera AI is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape the silicon and packaging architecture of our AI accelerators. You will own power-delivery design end-to-end, from on-die grids to package PDN, and drive 2.5D/3D packaging strategies with cross-functional teams in R&D Custom Design.

You will collaborate with Silicon Engineering and AI Integrated Systems to align power delivery with product requirements, perform SI/PI verification, and mentor colleagues while

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, or related field.
• 7+ years in power delivery and/or advanced packaging design in a semiconductor environment.
• Expertise in on-die power grid design and PDN analysis.

Responsibilities

• Own power delivery design end-to-end from on-die grids to package PDN.
• Lead advanced packaging architecture for 2.5D/3D stacking and multi-chiplet integration.
• Perform SI/PI verification and sign-off across the full stack.
• Collaborate with Silicon Engineering and AIIS to align solutions with product needs.
• Support thermal and integration reviews for current and future products.
• Develop and maintain power-delivery methodology and design guidelines.
• Mentor team and engage with external partners to co-develop solutions.

Skills

Power delivery design

2.5D/3D IC packaging

PDN analysis

Power integrity

SI/PI verification

Cross-functional collaboration

English communication

Education

Bachelor’s or Master’s in Electrical Engineering

PhD (a plus)

Tools

EDA tools

Job description

Axelera AI is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape the silicon and packaging architecture of our AI accelerators. You will own power-delivery design end-to-end, from on-die grids to package PDN, and drive 2.5D/3D packaging strategies with cross-functional teams in R&D Custom Design.

You will collaborate with Silicon Engineering and AI Integrated Systems to align power delivery with product requirements, perform SI/PI verification, and mentor colleagues while