Lead Power Delivery & 3D Packaging for AI Accelerators

Axelera; Eindhoven, Amsterdam; Hybrid; EUR 70,000 - 90,000; Full time

Benefits offered by this job

Pension plan

Employee insurances

Option for company shares

Job summary

Axelera AI in Eindhoven is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape the silicon architecture of AI accelerators. You will lead power delivery design and contribute to advanced packaging solutions while collaborating with engineering teams.

The ideal candidate has over 7 years of experience in power delivery design and a strong understanding of advanced packaging technologies. The role offers a competitive salary with comprehensive benefits and encourages innovation and collaboration.

Qualifications

• 7+ years of experience in semiconductor packaging design.
• Hands-on experience with 2.5D and 3D IC packaging technologies.
• Strong written and spoken English communication skills.

Responsibilities

• Own power delivery design from on-die grids to PCB PDN.
• Lead packaging architecture decisions for multi-chiplet integration.
• Collaborate with teams to align packaging solutions with product needs.

Skills

Power delivery design

Advanced packaging technologies

SI/PI verification

Cross-functional communication

Education

Bachelor’s or Master’s degree in Electrical Engineering

PhD in related field

Tools

EDA tools for power integrity

Job description

Axelera AI in Eindhoven is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape the silicon architecture of AI accelerators. You will lead power delivery design and contribute to advanced packaging solutions while collaborating with engineering teams.

The ideal candidate has over 7 years of experience in power delivery design and a strong understanding of advanced packaging technologies. The role offers a competitive salary with comprehensive benefits and encourages innovation and collaboration.