RF/mmWave Package Design Engineer

NXP Semiconductors NV; Nijmegen; On-site; EUR 90,000 - 130,000; Full time

Job summary

NXP Semiconductors in the Netherlands seeks a senior package design engineer to lead the development of advanced mixed-signal, RF, and mmWave semiconductor packages. You’ll own architecture, die-package co-design, layout, and reliability optimization, interfacing with SoC designers, assembly sites, and suppliers.

The role emphasizes collaboration across global teams, design-rule compliance, and documentation to meet electrical, thermal, manufacturability, and cost objectives.

Qualifications

• Five plus years direct experience designing flip chip and wire-bond substrate-based and WLCSP/FOWLP semiconductor packages.
• Expert proficiency with Cadence Allegro Package Designer (APD) and AutoCAD required.
• Experience with die-package-PCB codesign methodologies desired.
• Knowledge of Power Integrity and Signal Integrity (PISI) and high-speed signal routing, differential pair implementation, return-path management, and impedance-controlled interconnect design a plus.
• Strong understanding of substrate technologies including design rules as well as Geometric Dimensioning and Tolerancing.
• Experience with or extensive exposure to primarily analog SoC design preferred.

Responsibilities

• Responsible for all aspects of package design from concept through best in class solution with optimal cost, manufacturability, performance and reliability.
• Utilize various industry standard die / package co-design and layout tools for design.
• Participate in die/package/PCB codesign activities, supporting critical signal paths, package architecture, floorplanning, bump maps, stackups, and routing implementation.
• Design and optimize package structures for RF and mmWave applications, including controlled-impedance routing, grounding, shielding, and signal-launch structures.
• Collaborate with simulation engineers to evaluate electrical performance, SI/PI, EM behavior, and implement design improvements.
• Support package design reviews, manufacturability assessments, design-rule compliance, and release documentation.
• Partner with assembly sites, OSATs, substrate suppliers, and cross-functional teams to deliver robust, manufacturable package solutions.
• Provide technical guidance on package architecture, substrate technologies, assembly processes, and RF package implementation.

Skills

Power Integrity & Signal Integrity

High-speed routing

Geometric Dimensioning & Tolerancing

Analog SoC design exposure

Education

Bachelor's or Master's degree in Electrical, Mechanical, Materials Engineering, or equivalent

Tools

Cadence Allegro Package Designer (APD)

AutoCAD

Job description

NXP Semiconductors in the Netherlands seeks a senior package design engineer to lead the development of advanced mixed-signal, RF, and mmWave semiconductor packages. You’ll own architecture, die-package co-design, layout, and reliability optimization, interfacing with SoC designers, assembly sites, and suppliers.

The role emphasizes collaboration across global teams, design-rule compliance, and documentation to meet electrical, thermal, manufacturability, and cost objectives.