RF & mmWave Package Design Engineer

NXP Semiconductors NV; Eindhoven; On-site; EUR 90,000 - 120,000; Full time

Job summary

NXP Semiconductors NV in the Netherlands is seeking a Senior Package Design Engineer to drive advanced RF/mmWave packaging solutions across mixed-signal products. You will lead die-package co-design, layout optimization and reliability testing with cross-functional teams.

The role requires deep experience with Cadence Allegro APD and AutoCAD, strong knowledge of Power Integrity and Signal Integrity, and a proven track record in high-speed interconnect design for automotive and radar applications.

Qualifications

• Bachelor's or Master's degree in Electrical, Mechanical, Materials Engineering or equivalent.
• 5+ years direct experience designing flip chip and substrate-based packages.
• Expert proficiency with Cadence Allegro APD and AutoCAD.
• Experience with die-package-PCB co-design methodologies desired.
• Knowledge of Power Integrity and Signal Integrity and high-speed routing is a plus.

Responsibilities

• Design and manage all aspects of package design from concept to manufacturable solution with emphasis on cost, performance and reliability.
• Use die/package co-design and layout tools for design of RF/microwave/millimeter-wave packages.
• Support die/package/PCB codesign activities, critical signal paths, floorplanning, bump maps, stackups and routing.
• Design and optimize package structures for RF/mmWave applications including controlled-impedance routing, grounding and shielding.
• Collaborate with simulation engineers to evaluate electrical performance and implement improvements.
• Support design reviews, manufacturability assessments, and release documentation.
• Coordinate with assembly sites, OSATs and substrate suppliers to deliver robust solutions.
• Provide guidance on package architecture, substrate technologies and RF packaging implementation.

Skills

APD

AutoCAD

Die-package-PCB co-design

High-speed routing

Power Integrity

Signal Integrity

Analog SoC exposure

Education

Bachelor's or Master's in Electrical/Mechanical/Materials Eng

Tools

Cadence Allegro Package Designer (APD)

AutoCAD

Job description

NXP Semiconductors NV in the Netherlands is seeking a Senior Package Design Engineer to drive advanced RF/mmWave packaging solutions across mixed-signal products. You will lead die-package co-design, layout optimization and reliability testing with cross-functional teams.

The role requires deep experience with Cadence Allegro APD and AutoCAD, strong knowledge of Power Integrity and Signal Integrity, and a proven track record in high-speed interconnect design for automotive and radar applications.