Lead Hybrid Bonding Infrastructure Architect
ASML Holding
An application made for this job — a tailored resume and cover letter that speak straight to the posting.
Job summary
ASML Holding seeks a Principal Infrastructure Researcher to define and realize a high-end research infrastructure for advanced hybrid bonding impacting future lithography tools. You will shape the infrastructure strategy, coordinate equipment selection, and ensure experimental environments meet stringent requirements.
The role requires leadership in complex lab setups, collaboration with research institutes and industrial partners, and deep expertise in 3D integration and semiconductor
Qualifications
- PhD in Semiconductor Processing or related field, or MSc with extensive relevant experience.
- Proven experience in semiconductor process development, thin film processing, advanced packaging, wafer bonding, or related technology domains.
- Experience with development and deployment of complex laboratory or manufacturing infrastructure.
- Strong understanding of 3D integration.
Responsibilities
- Define the infrastructure roadmap for advanced hybrid bonding research and translate requirements into investments.
- Lead the realization of bonding research facilities, lab capabilities, and demonstrator environments.
- Coordinate procurement, installation, qualification, and readiness of equipment.
- Engage with external partners, universities, and suppliers to accelerate technology development.
Skills
Education
Tools
Job description
ASML Holding seeks a Principal Infrastructure Researcher to define and realize a high-end research infrastructure for advanced hybrid bonding impacting future lithography tools. You will shape the infrastructure strategy, coordinate equipment selection, and ensure experimental environments meet stringent requirements.
The role requires leadership in complex lab setups, collaboration with research institutes and industrial partners, and deep expertise in 3D integration and semiconductor
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