Lead Expert - Hybrid Bonding, CMP & Advanced Packaging Metrology

Nearfield Instruments; Rotterdam; On-site; EUR 110,000 - 170,000; Full time

Job summary

Nearfield Instruments seeks a senior semiconductor expert to lead CMP, hybrid bonding, wafer-to-wafer and die-to-wafer integration. You will translate metrology needs into product roadmaps, define critical measurements, and drive new applications and features that deliver value for customers.

You\'ll lead cross-functional teams, engage with customers and partners, and shape R&D directions to improve yield, process stability, and manufacturing performance in high-volume fabs.

Qualifications

• Significant experience in semiconductor process integration, CMP, hybrid bonding, or advanced packaging.
• Strong understanding of metrology, inspection, and process control in high-volume manufacturing.
• Experience working with leading semiconductor fabs, equipment suppliers, or advanced R&D organizations.
• Proven ability to lead cross-functional teams and convert complex process challenges into differentiated products and applications.

Responsibilities

• Lead identification of unmet metrology needs and critical process-control gaps in CMP, hybrid bonding, and advanced packaging.
• Define valuable measurements, specifications, and use cases, including topography, dishing, erosion, surface roughness, edge roll-off, wafer shape, bonding interfaces, and full-die uniformity.
• Set application priorities and translate customer and manufacturing needs into product and technology roadmaps.
• Lead engagement with customers, process engineers, and equipment partners to validate requirements and accelerate adoption.
• Drive development of metrology solutions that improve yield, process stability, qualification time, and manufacturing performance.
• Guide R&D and product teams on measurement performance, workflow integration, sampling strategies, and high-volume manufacturing requirements.

Skills

CMP

Hybrid bonding

Advanced packaging

Metrology

Process control

Cross-functional leadership

Job description

Overview

Nearfield Instruments (NFI) is a fast-growing, high-tech scale-up. We design, develop, integrate, market, and service advanced metrology machines. Our solutions enable the world’s leading chipmakers to increase production yield and improve device performance—powering smaller, faster, and more energy-efficient electronics.

Nearfield brings together leading experts in science and engineering to develop a unique, high-throughput SPM platform delivering true 3D, sub-nanometer resolution metrology at production scale.

We are looking for a senior semiconductor expert with deep experience in hybrid bonding, chemical mechanical planarization (CMP), and advanced packaging, gained within a leading-edge fab, research institute, or semiconductor equipment company.

This expert will lead Nearfield Instruments’ application and technology direction for CMP, hybrid bonding, wafer-to-wafer and die-to-wafer integration, and advanced packaging. The role will identify the most critical process-control challenges, translate them into clear metrology requirements, and drive the development of new applications, capabilities, and product features that create greater value for customers.

Responsibilities

• Lead the identification of unmet metrology needs and critical process-control gaps in CMP, hybrid bonding, and advanced packaging.
• Define the most valuable measurements, specifications, and use cases, including topography, dishing, erosion, surface roughness, edge roll-off, wafer shape, bonding interfaces, and full-die uniformity.
• Set application priorities and translate customer and manufacturing needs into product and technology roadmaps.
• Lead engagement with customers, process engineers, and equipment partners to validate requirements and accelerate adoption.
• Drive the development of metrology solutions that improve yield, process stability, qualification time, and manufacturing performance.
• Guide R&D and product teams on measurement performance, workflow integration, sampling strategies, and high-volume manufacturing requirements.

Qualifications

• Significant experience in semiconductor process integration, CMP, hybrid bonding, or advanced packaging.
• Strong understanding of metrology, inspection, and process control in high-volume manufacturing.
• Experience working with leading semiconductor fabs, equipment suppliers, or advanced R&D organizations.
• A proven ability to lead cross-functional teams and convert complex process challenges into differentiated products and applications.