Senior Engineer Mid End (Trim & Form)

Nexperia; Seremban; On-site; MYR 180,000 - 240,000; Full time

Job summary

Nexperia in Malaysia seeks a Senior Equipment Engineer (Trim & Form) to drive reliability, performance and continuous improvement of high‑volume trim and form operations. You will lead maintenance and support new product introductions while collaborating with R&D, NPI, Product Design and Reliability to align equipment capability with process requirements.

The role requires a bachelor’s degree in engineering and at least five years in the semiconductor industry, with three years in trim and form

Qualifications

• Bachelor’s degree in engineering or related technical discipline.
• Minimum 5 years in the semiconductor industry, with at least 3 years in trim and form equipment.
• Strong hands-on experience with trim and form machines used in semiconductor packaging.
• Solid understanding of tooling design, GD&T, tolerances and metrology equipment.
• Proficiency in JMP and Minitab for data analysis.
• Proven leadership in guiding technicians in a 24/7 manufacturing environment.

Responsibilities

• Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple package types.
• Monitor downtime and perform MTBF/MTBA analysis to drive mitigation strategies.
• Collaborate with Process Engineering on NPI readiness and qualification for high-volume manufacturing.
• Develop and maintain technical documentation including control plans, SOPs, FMEAs.
• Mentor technicians and drive KPI setting and performance reviews.

Skills

People leadership

Cross-functional collaboration

Analytical thinking

Process improvement

Technical mentoring

Education

Bachelor’s degree in engineering or related technical discipline

Tools

JMP

Minitab

Job description

As a Senior Equipment Engineer (Trim & Form), you will be responsible for driving equipment reliability, performance, and continuous improvement of trim and form operations in a high-volume semiconductor manufacturing environment. This role combines strong equipment engineering leadership with solid process and tooling knowledge to support new product introductions, yield improvement, and advanced packaging technologies. You will work closely with cross‑functional teams.

What You Will Do

Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types. Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy‑off. Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high‑volume manufacturing (HVM). Collaborate with cross‑functional teams to develop, maintain, and update technical documentation, including control plans, process specifications, SOPs, FMEAs, and technical reports. Plan and manage technician headcount coverage to support 24/7 operations; delegate tasks effectively and provide clear, transparent updates. Mentor and coach technicians to enhance technical capability and engineering mindset, including KPI setting and annual performance evaluations. Work closely with R&D, NPI, Product Design, and Reliability teams to align trim and form equipment capability with package architecture and process requirements. Diagnose and resolve trim and form equipment, tooling, and process‑related defects impacting yield and product quality. Support technology, process, and equipment transfers and ensure smooth ramp‑up to HVM. Contribute to process technology roadmaps supporting advanced packaging, thin form factors, and emerging device architectures. Drive continuous improvement initiatives such as MVA, yield enhancement, and UPH optimization. Manage spare parts inventory, procurement activities, and cost‑optimization initiatives. Liaise with suppliers and vendors for tooling, jigs, and fixtures; closely monitor delivery schedules for spare and non‑spare items. Perform effectively in a fast‑paced, dynamic manufacturing environment.

What You Will Need

Bachelor’s degree in engineering or a related technical discipline. Minimum 5 years of experience in the semiconductor industry, with at least 3 years specializing in trim and form equipment and tooling. Strong hands‑on experience with trim and form machines used in semiconductor packaging. Solid understanding of tooling design, material properties and behavior, GD&T, tolerances, and metrology equipment (added advantage). Proficiency in statistical analysis tools such as JMP and Minitab, with strong technical documentation skills. Proven leadership capability with experience guiding technicians in a 24/7 manufacturing environment. Strong analytical, problem‑solving, and cross‑functional communication skills.

Diversity & Inclusion Statement

As an equal‑opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and our dedication is demonstrated by our partnership with the Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, providing a safe work environment and reasonable adjustments where requested. We offer employees the possibility to join employee resource groups such as the Pride Network Group and local Women’s groups. Nexperia is committed to increasing women in management positions to 30% by 2030.