Staff Substrate Yield Lead, EMIB-T & Advanced Packaging

Intel Corporation; Kulim; Hybrid; MYR 300,000 - 540,000; Full time

Benefits offered by this job

Hybrid work model

Job summary

Intel Corporation is seeking a Staff Technology Development Substrate Yield Lead to drive supplier yield, defect reduction, and process-control maturity for next-generation EMIB-T substrates. You will lead structured investigations, set action plans, and ensure timely closure across supplier lines in a high-visibility role.

The role requires strong technical depth in semiconductor manufacturing, advanced packaging, and yield engineering, with experience in analytics, SPC, and automated defect

Qualifications

• Requires strong analytical and problem-solving abilities.
• Data-driven decision making across complex environments.
• Ability to influence cross-functional teams and suppliers.

Responsibilities

• Own day-to-day yield performance and issue closure for assigned supplier lines and processes.
• Lead investigations from containment through corrective actions and sustainment.
• Develop dashboards and automated analytics to monitor yield and drive improvements.

Job description

Intel Corporation is seeking a Staff Technology Development Substrate Yield Lead to drive supplier yield, defect reduction, and process-control maturity for next-generation EMIB-T substrates. You will lead structured investigations, set action plans, and ensure timely closure across supplier lines in a high-visibility role.

The role requires strong technical depth in semiconductor manufacturing, advanced packaging, and yield engineering, with experience in analytics, SPC, and automated defect