Leadframe Process & Tooling Expert — Yield & Innovation Driver

STMicro

Muar

On-site

MYR 150,000 - 210,000

Full time

14 days+
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Job summary

STMicroelectronics is seeking a Process Engineer – Leadframe Process & Tooling Expert to develop, optimize, and sustaining assembly leadframe processes in a high-volume semiconductor environment. You will own Lead Lock Tape and Lead Trimming operations, define parameters, and drive yield improvements.

The role requires a strong background in leadframe tooling, process control tools, and hands-on engineering leadership.

Qualifications

  • Bachelor’s degree in Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, Material Science, or a related field.

Responsibilities

  • Own and sustain Lead Lock Tape and Lead Trimming assembly processes.
  • Define, optimize, and troubleshoot process parameters to ensure stable output, high yield, and product quality.
  • Support tooling design, qualification, modification, and troubleshooting for leadframe and assembly operations.
  • Investigate process and tooling issues, identify root causes, and implement corrective actions.
  • Lead process improvement activities using structured problem-solving and data-driven methods.
  • Support NPI, process transfer, qualification, and ramp-up activities.
  • Collaborate with Production, Quality, Equipment, Maintenance, and Tooling teams to resolve technical issues.
  • Conduct process capability analysis, DOE, SPC, and yield loss studies.
  • Drive scrap reduction, cycle time improvement, productivity, and cost reduction initiatives.
  • Maintain and update SOPs, control plans, specifications, and troubleshooting guides.

Skills

Leadframe
Lead Lock Tape
Lead Trimming
Process Optimization
Data Analysis
Excel
Minitab

Education

Bachelor's degree in Mechanical/Manufacturing/Industrial Engineering

Tools

Leadframe tooling
SPC
DOE
FMEA

Job description

STMicroelectronics is seeking a Process Engineer – Leadframe Process & Tooling Expert to develop, optimize, and sustaining assembly leadframe processes in a high-volume semiconductor environment. You will own Lead Lock Tape and Lead Trimming operations, define parameters, and drive yield improvements.

The role requires a strong background in leadframe tooling, process control tools, and hands-on engineering leadership.

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