Module Engineer – Semiconductor Process & Yield Leader

Intel Technology Sdn. Bhd.; Bayan Lepas; On-site; MYR 120,000 - 180,000; Full time

Benefits offered by this job

Medical

Miscellaneous allowance

Education support

Dental

Sports

Parking

Vision

Meal subsidy

Job summary

Intel Technology Sdn. Bhd. in Penang is seeking a senior process engineer to own Ball Attach manufacturing, drive yield improvements, and collaborate with multiple engineering teams to ensure safety, quality, and productivity targets.

You will optimize equipment performance, support tool readiness, and lead process qualifications across local and global sites while maintaining comprehensive process documentation.

Qualifications

• 4+ years of relevant experience with Bachelor’s degree; 3 years with Master’s; 0 years with PhD.
• Experience in semiconductor manufacturing environments (assembly/packaging/high-volume).
• Knowledge of process engineering fundamentals and statistical methods; strong problem-solving skills.
• Experience in Ball Attach, Die Attach, Flip Chip, Advanced Packaging, Assembly, or Backend semiconductor processes (preferred).
• Proficiency in DOE, SPC, FMEA, and root cause analysis (preferred).
• Strong understanding of semiconductor equipment, process characterization, and yield improvement techniques (preferred).
• Experience with equipment qualification, troubleshooting, maintenance coordination, and performance optimization (preferred).

Responsibilities

• Own and sustain Ball Attach manufacturing processes and equipment to meet safety, quality, productivity, and yield targets.
• Monitor and control key process parameters to ensure compliance with specifications.
• Perform process characterization, troubleshooting, root cause analysis, and corrective actions.
• Drive continuous improvement via DOE, SPC, and data-driven methods to optimize process capability and equipment performance.
• Partner with vendors and internal teams to improve tool reliability and manufacturing readiness.
• Develop and implement preventive measures to minimize excursions, defects, and issues.
• Support equipment installation, qualification, conversion, and ramp activities with safety and quality in mind.
• Collaborate with Process Engineering, Manufacturing, Quality, Product Engineering, and Equipment Engineering to resolve challenges.
• Lead technology transfers, process qualifications, and manufacturing readiness across sites.
• Maintain process docs, SOPs, specs, and reports for operational excellence.

Skills

Ball Attach

Die Attach

Flip Chip

Advanced Packaging

Assembly

Backend Manufacturing

DOE

SPC

FMEA

Root Cause Analysis

Process Engineering Fundamentals

Statistical Analysis

Problem Solving

Equipment Qualification

Troubleshooting

Maintenance Coordination

Performance Optimization

Design of Experiments

Education

Bachelor’s in Engineering

Job description

Intel Technology Sdn. Bhd. in Penang is seeking a senior process engineer to own Ball Attach manufacturing, drive yield improvements, and collaborate with multiple engineering teams to ensure safety, quality, and productivity targets.

You will optimize equipment performance, support tool readiness, and lead process qualifications across local and global sites while maintaining comprehensive process documentation.