Staff Packaging Engineer - Structural Simulation

Sandisk; Batu Kawan; On-site; MYR 180,000 - 300,000; Full time

Job summary

Sandisk is seeking a Staff Engineer in Packaging Engineering to join the Packaging R&D group. You will model, simulate, design experiments, and test mechanical aspects of semiconductor packaging and flash products, collaborating across design, characterization, and reliability teams.

The role requires a Ph.D. in Mechanical Engineering with 3+ years of experience or an MS with 5+ years, and a strong background in IC packaging mechanics and FEA-driven validation.

Qualifications

• Ph.D. in Mechanical Engineering with >3 years of experience, or M.S. with >5 years of experience.
• Strong background in IC packaging mechanics and related areas.
• Experience with computational or experimental solid mechanics and failure analysis.
• Knowledge of machine learning and data analytics is a plus.

Responsibilities

• Modeling, simulation, and testing of mechanical responses of IC packages and flash products (incl. SSDs).
• Influence package and product design to address structural integrity and reliability.
• Interface with design, characterization, reliability, and R&D teams.
• Develop automation for structural simulation using tools like ANSYS or Abaqus.

Skills

Solid mechanics

FEA

DOE

Computational mechanics

Education

PhD in Mechanical Engineering

MS in Mechanical Engineering

Tools

ANSYS

Abaqus

Job description

Sandisk is seeking a Staff Engineer in Packaging Engineering to join the Packaging R&D group. You will model, simulate, design experiments, and test mechanical aspects of semiconductor packaging and flash products, collaborating across design, characterization, and reliability teams.

The role requires a Ph.D. in Mechanical Engineering with 3+ years of experience or an MS with 5+ years, and a strong background in IC packaging mechanics and FEA-driven validation.