Senior SSD Packaging & DFMA Engineer

Sandisk; Batu Kawan; On-site; MYR 90,000 - 130,000; Full time

Job summary

Sandisk seeks a Packaging Engineering specialist in Batu Kawan, Malaysia, to lead RCCA-driven improvements across SSD assembly processes. You will conduct DOEs, DFMA reviews, and support fixture design to optimize manufacturing performance.

The role requires a mechanical engineering background with 3–8 years in semiconductor/automation contexts, plus strong analytical and communication skills to present complex data to diverse teams.

Qualifications

• Bachelor's degree in Mechanical Engineering or related discipline.
• 3–8 years of engineering experience in semiconductor/automation sectors preferred.
• Strong ability to analyze complex engineering problems and communicate results clearly.

Responsibilities

• Facilitate RCCA initiatives with cross-functional teams for effective corrective actions.
• Design and apply robust DOEs with advanced statistical methods for data-driven decisions.
• Perform DFMA evaluations for SSD assembly and contribute to machine/fixture design.

Skills

FMEA

8D

DMAIC

JMP

Minitab

SolidWorks CAD

Education

Bachelor's Degree in Mechanical Engineering

Tools

SolidWorks Flow Simulation

Job description

Sandisk seeks a Packaging Engineering specialist in Batu Kawan, Malaysia, to lead RCCA-driven improvements across SSD assembly processes. You will conduct DOEs, DFMA reviews, and support fixture design to optimize manufacturing performance.

The role requires a mechanical engineering background with 3–8 years in semiconductor/automation contexts, plus strong analytical and communication skills to present complex data to diverse teams.