Senior NPI Assembly Engineer - Semiconductor Packaging

ON Semiconductor Malaysia Sdn. Bhd.; Seremban; On-site; MYR 120,000 - 180,000; Full time

Job summary

ON Semiconductor Malaysia Sdn. Bhd.

is seeking a Senior NPI Assembly Engineer to lead New Product Introduction activities for semiconductor assembly processes from development to high-volume manufacturing. You will own process qualification, drive DOE studies, optimize parameters, and ensure production readiness, with collaboration across product, process, quality, equipment, and supply chain teams to transfer and ramp new products.

Qualifications

• 5–8 years of experience in semiconductor assembly manufacturing or NPI.
• Experience leading new product introductions and product transfers.
• Strong experience in assembly process development and qualification.
• Experience in high-volume semiconductor manufacturing environments.
• Familiarity with IATF 16949 and APQP is an advantage.

Responsibilities

• Define assembly manufacturing flow, process parameters, and control plans.
• Lead process characterization studies and DOE.
• Establish process windows and optimize manufacturing parameters.
• Perform process qualifications according to internal and customer requirements.
• Drive equipment and process readiness for new package introductions.
• Provide technical leadership for assembly operations including Die Attach, Wire Bond, Wafer Saw, Molding, Trim & Form, Singulation, Marking, Packing.
• Troubleshoot process issues during pilot builds and ramp-up.
• Drive yield improvement and cycle time reduction initiatives.
• Lead failure analysis and root cause investigations for NPI-related issues.
• Support reliability qualification activities such as HTOL, TC, HAST, MSL, Autoclave.
• Ensure compliance with automotive, industrial, medical, or consumer quality requirements where applicable.
• Drive corrective and preventive actions (CAPA).
• Create and maintain documentation: Process Flow, FMEA, Control Plan, Work Instructions, Qualification Reports, Engineering Specifications.
• Support ECOs and PCNs; ensure product documentation is complete before production release.
• Drive yield enhancement and cost reduction initiatives.
• Apply SPC methodologies for process improvement.
• Implement Lean Manufacturing and Six Sigma practices.

Skills

SPC

DOE

FMEA

MSA

8D Problem solving

Root Cause Analysis

Reliability Testing

Process Qualification

Data Analysis

Yield Improvement

Defect Reduction

Equipment Qualification

Process Validation

Semiconductor Packaging

Education

Electrical Engineering

Electronics Engineering

Mechanical Engineering

Manufacturing Engineering

Materials Engineering

Semiconductor Disciplines

Tools

Minitab

JMP

Excel

Job description

ON Semiconductor Malaysia Sdn. Bhd.

is seeking a Senior NPI Assembly Engineer to lead New Product Introduction activities for semiconductor assembly processes from development to high-volume manufacturing. You will own process qualification, drive DOE studies, optimize parameters, and ensure production readiness, with collaboration across product, process, quality, equipment, and supply chain teams to transfer and ramp new products.