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PRO3C (MALAYSIA) Sdn Bhd, a regional electronics manufacturer, is hiring a Senior SMT Process Engineer to optimize production and ensure quality at the Kulai site. The role requires a Bachelor’s or Diploma in engineering and 2–5 years in SMT process engineering, with hands-on knowledge of SPI, AOI, reflow ovens, printers, and P&P machines.
Great communication, teamwork, and proficiency in MS Office are essential; English is required, Mandarin a plus.
Job Requirements:
Bachelor's Degree or Diploma in Electronic Engineering, Manufacturing Engineering, Mechanical Engineering, or related field.
Minimum 2–5 years of SMT process engineering experience (experience requirement can be adjusted).
Good knowledge of SMT equipment and processes.
Familiar with SPI, AOI, Reflow Oven, Screen Printer, Pick & Place machines.
Knowledge of IPC-A-610, IPC J-STD-001, and ESD standards.
Experience with Lean Manufacturing, Six Sigma, SPC, DOE, PFMEA is an advantage.
Strong analytical and problem-solving skills.
Good communication and teamwork skills.
Proficient in Microsoft Office.
Good command of English; Mandarin is an added advantage.
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Manufacturing, Transport & Logistics 101-1,000 employees
Regional subsidiary of PRIME Technology (Guangzhou) Inc., a technology company with over 30 years of expertise in high-precision electronic design, research, and manufacturing. Company are doing manufacturing for PCBA and micro-assembly electronics solutions. To support products and solutions for industries such as automotive, aviation, industrial, maritime, communication, medical, and consumer electronics. Aligns with cutting-edge production practices and technology development in semiconductor packaging and electronics solutions.
Regional subsidiary of PRIME Technology (Guangzhou) Inc., a technology company with over 30 years of expertise in high-precision electronic design, research, and manufacturing. Company are doing manufacturing for PCBA and micro-assembly electronics solutions. To support products and solutions for industries such as automotive, aviation, industrial, maritime, communication, medical, and consumer electronics. Aligns with cutting-edge production practices and technology development in semiconductor packaging and electronics solutions.