Senior Packaging Engineer – Mechanical Development (SSD/DFMA)

Sandisk

Batu Kawan

On-site

MYR 90,000 - 130,000

Full time

14 days+

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Job summary

Sandisk is seeking a Senior Packaging Engineer (Mechanical Development) in Malaysia to drive mechanical development for SSD packaging. You will run DOEs, perform RCCA, and lead DFMA review across design packages and fixtures.

Expect collaboration with cross‑functional teams to ensure robust product qualification and manufacturing readiness. The role requires a Mechanical Engineering degree and 3–8 years in the semiconductor/automation field, with strong skills in DOE, FMEA, DFMA, and CAD tools.

Qualifications

Bachelor’s Degree in Mechanical Engineering or related field with scholastic excellence.
3–8 years of professional engineering experience in semiconductor/automation preferred.
Proven ability to analyze and solve complex engineering challenges with innovative approaches.
Strong ability to present design concepts/data to technical and non‑technical audiences, especially for DOE.
Excellent verbal and written communication skills.

Responsibilities

Perform RCCA initiatives with cross‑functional teams.
Design and run robust DOEs and apply statistical methods for complex problems.
Evaluate DFMA for SSD assembly and design machines/fixtures for optimal performance.
Design SSD assembly jigs/fixtures and create mechanical drawings.
Develop Qualification Packages including specs, drawings, DFM guidelines, and QMPs.
Lead engineering characterization and cost‑reduction projects; support emergency task forces.