PI/SI/STA Engineer – High-Speed SoC & Packaging

XINPAL (MALAYSIA) SDN. BHD.; Bayan Lepas; On-site; MYR 60,000 - 90,000; Full time

Job summary

XinPal Malaysia in Bayan Lepas, Penang seeks a PI/SI/STA Engineer to support signal and power integrity, timing analysis, and sign-off for advanced SoC and high‑performance packaging projects. You will run simulations, correlate results with lab or silicon data, and work with cross‑functional teams to mitigate risks.

Applicants should have a Bachelor’s or Master’s in EE or Physics and 2–3 years’ relevant industry experience, plus hands‑on use of Ansys, Sigrity and Synopsys PrimeTime/RedHawk.

Qualifications

• 2–3 years of experience in SI, PI or STA with exposure to modern packaging or high-speed designs.
• Solid understanding of high-speed interface behavior, parasitics and IR-drop effects on STA.
• Hands-on with electromagnetic, SI/PI, thermal or sign-off timing tools.

Responsibilities

• Execute PI, SI and IR-drop-aware timing analysis to support design sign-off.
• Perform end-to-end simulations for PDN, high-speed channels, and thermal performance.
• Collaborate with package design, floorplanning, timing, and PHY/IO teams to resolve issues.

Skills

Signal Integrity

Power Integrity

STA

SI/PI analysis

Education

Bachelor's in Electrical Engineering

Master's in Electrical Engineering or Physics

Tools

Ansys

Sigrity

Synopsys PrimeTime/RedHawk

Job description

XinPal Malaysia in Bayan Lepas, Penang seeks a PI/SI/STA Engineer to support signal and power integrity, timing analysis, and sign-off for advanced SoC and high‑performance packaging projects. You will run simulations, correlate results with lab or silicon data, and work with cross‑functional teams to mitigate risks.

Applicants should have a Bachelor’s or Master’s in EE or Physics and 2–3 years’ relevant industry experience, plus hands‑on use of Ansys, Sigrity and Synopsys PrimeTime/RedHawk.