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Carsem (M) Sdn. Bhd in Kuala Lumpur is seeking a Senior Sustainability & Business Analyst based in KL to help prepare the Annual Sustainability Statement for the Integrated Annual Report.
You will gather data from multiple teams, analyze inputs, and support the transition to IFRS S1 reporting under NSRF and Bursa Malaysia requirements, while staying current with IFRS S1/S2, GRI, FTSE, and SASB. You'll coordinate monthly site-level and quarterly Steering Committee meetings, engage with customers,
Help prepare the company's Annual Sustainability Statement, which forms part of the Integrated Annual Report.
Garner and analyze data and inputs from different teams to make sure the report is accurate and complete.
Play a key role in the company's transition to IFRS S1 reporting, which MPI is required to adopt by FY28 under the National Sustainability Reporting Framework (NSRF) and Bursa Malaysia's requirements - building on the IFRS S2 standard already adopted in FY26.
Keep up to date with evolving sustainability standards, methodologies, and frameworks, including IFRS S1/S2, GRI, FTSE, and SASB.
Track relevant regulatory developments across Malaysia, China, the EU, the US, and globally, and flag implications for the company early.
Translate new standards and regulations into practical recommendations for management and the reporting process.
Organise, support & drive monthly site-level working committee meetings, chaired by General Managers and attended by representatives from Facility, HR, Finance, and Health & Safety.
Organise, support & drive quarterly Steering Committee meetings, chaired by the Group Managing Director and attended by the CFO and General Managers of various operations.
Respond to sustainability-related requests, questions, and surveys from customers, investors, and regulators (for example, CDP).
Build good working relationships with these stakeholders and represent the company professionally.
Carry out analysis on sustainability topics as needed (for example, Science Based Targets initiative or SBTi) and present findings to management, including cost and resource implications, to support decision‑making.
Provide analytical and coordination support on ad‑hoc corporate strategy work and special projects as needed.
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).