Front-of-Line (FOL) Process Engineer

Carsem (M) Sdn. Bhd; Ipoh; Presencial; MYR 120.000 - 180.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Medical

Education support

Dental

Parking

Car subsidy

Medical for immediate family

Descripción de la vacante

Carsem (M) Sdn. Bhd is seeking a Senior Engineer to sustain daily production operations and lead continuous improvement in Front of Line Assembly processes, including Die Attach, Flip Chip and Wire Bonding.

You will focus on achieving targets for yield, quality, productivity and cost through engineering solutions and technical leadership. The role requires 3+ years in semiconductor manufacturing, a degree in Engineering, and hands-on experience with RCA, DMAIC and SPC.

Formación

• Root cause analysis and problem solving methodologies.
• Experience with 8D and DMAIC methodologies.
• FOL processes exposure such as Die Attach, Flip Chip, or Wire Bonding is advantageous.

Responsabilidades

• Provide technical support to ensure smooth production operations.
• Monitor and drive improvements in yield, quality, productivity, and cost.
• Lead continuous improvement projects and process optimization initiatives.
• Develop new processes and evaluate materials or equipment for enhancements.
• Determine standard UPH and ensure capacity for new equipment.
• Review process capability and implement corrective or preventive actions.
• Train and coach technicians; support development of junior staff.
• Perform other duties as required.

Conocimientos

Root Cause Analysis (RCA)

Problem Solving Methodologies

8D Problem Solving

DMAIC

SPC (Statistical Process Control)

FOL/Die Attach/Flip Chip/Wire Bonding

Educación

Degree in Engineering or equivalent

Descripción del empleo

The Senior Engineer is responsible for sustaining daily production operations and driving continuous improvement initiatives within the Front of Line (FOL) Assembly processes. This role focuses on achieving targets related to yield, quality, productivity, and cost through effective engineering solutions, process optimization, and technical leadership. The position will support key FOL processes such as Die Attach, Flip Chip, and Wire Bonding.

Key Responsibilities

Process & Technical Management

Provide technical support and effective solutions for process-related issues to ensure smooth production operations.

Monitor and improve key performance indicators such as yield, quality, productivity, and cost efficiency.

Drive continuous improvement projects and process optimization initiatives.

Develop new processes and evaluate materials or equipment for enhancement opportunities.

Improve process flow and update specifications based on customer requirements or internal product changes.

Determine standard UPH (Units Per Hour) and ensure sufficient machine capacity for new equipment installations.

Review process capability and recommend corrective or preventive actions when necessary.

Quality & Data Analysis

Ensure compliance with customer specifications and internal quality standards.

Prepare, analyze, and present yield, quality, and productivity data to management and customers.

Utilize data-driven tools to identify trends, root causes, and improvement opportunities.

People Management

Train, motivate, and coach technicians to achieve departmental goals.

Allocate tasks effectively and ensure proper follow-up on daily activities.

Support development of junior team members and operational staff.

Other Duties

Perform any other duties assigned by the immediate superior.

Job Requirements

Education

Degree in Engineering or equivalent discipline.

Working Experience

Minimum 3 years of relevant engineering experience, preferably in semiconductor manufacturing.

Technical Knowledge

Root Cause Analysis (RCA)

Problem Solving Methodologies

8D

DMAIC

Statistical Process Control (SPC)

Exposure to Assembly / FOL processes such as Die Attach, Flip Chip, or Wire Bonding is an added advantage.

Personal Attributes

Strong communication and interpersonal skills.

Able to lead and influence junior staff and operation teams.

Analytical and result-oriented mindset.

Good teamwork and cross-functional collaboration skills.

Ability to work in a fast-paced manufacturing environment.

Hirer responsiveness Salary match Number of applicants

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy