Senior Staff Packaging Engineer (Substrate Packaging)

Advanced Micro Devices, Inc

Penang

On-site

MYR 180,000 - 260,000

Full time

3 days ago
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Benefits offered by this job

AMD benefits at a glance

Job summary

Advanced Micro Devices, Inc. (AMD) in Penang, Malaysia seeks a lead for technology development and supply chain bring up of advanced substrate technologies to support the AMD roadmap.

You will collaborate with architects, designers and partners to define high-yield substrate solutions and qualify new packages for cost and yield targets. The role requires hands-on process development in packaging, with strong communication skills for cross-functional teams and global suppliers.

Qualifications

  • The candidate should have a hands-on approach to new process development with deep knowledge of packaging and board design rules, process flows and materials.
  • Hands-on development experience in advanced substrate technologies at a substrate supplier, OSAT or Fabless/IDM.
  • Excellent oral and written communication to communicate ideas and target requirements with suppliers, internal partners and AMD management.
  • BS, MS or PhD in Physics, Chemistry, Materials Science, Chemical Engineering or equivalent.

Responsibilities

  • Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors.
  • Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements.
  • Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks.
  • Partner with product, quality and manufacturing engineering teams to meet milestones for manufacturability, yield and reliability from concept through NPI.
  • Qualify package substrates of new products meeting cost and yield targets.

Skills

Packaging technology
Board design rules
Cross-functional leadership
Communication skills

Education

Degree in Physics / Chemistry / Materials Science / Chemical Engineering

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believetechnology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMDis shapingthefuture.

Whetheryou’redesigning next-gen processors, enabling AI breakthroughs, orbringing leading edge products to market, every role at AMD contributes to something bigger— technologythat moves the world forward.Join us and, together, we’ll advance your career.

THE ROLE

Lead technology development and supply chain bring up of advanced substrate technologies to support AMD product roadmap

THE PERSON

The candidate should have a proven track record in developing advanced packaging technologies at a substrate supplier, OSAT or Fabless/IDM, as well as identifying and enabling new substrate. He/she should have a hands-on approach to new process development with a deep knowledge of packaging and board design rules, process flows and materials. They should have excellent oral and written communication skills to communicate ideas and technology target requirements with suppliers, internal partners, product architects and AMD management.

KEY RESPONSIBILITIES
  • Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors
  • Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements
  • Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks.
  • Partner with product, quality and manufacturing engineering teams to meet various milestones for manufacturability, yield and reliability from concept through NPI.
  • Qualify package substrates of new products meeting cost and yield targets.
PREFERRED EXPERIENCE
  • Extensive experience leading cross functional teams to achieve technology certification, yield/cost reduction initiatives
  • Proven record of communicating complex technical challenges to executive level/management
  • Prior experience working with international teams across various time zones.
ACADEMIC CREDENTIALS
  • BS, MS or PhD in Physics, Chemistry, Material science, Chemical engineering or equivalent.
LOCATION

Penang, Malaysia

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

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