Senior Staff Engineer, Equipment Engineering (Plasma)

ams OSRAM

Kulim

In loco

MYR 120.000 - 180.000

Tempo pieno

14 giorni+

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Descrizione del lavoro

ams OSRAM Opto Semiconductors in Kulim, Malaysia seeks a senior Front-End Process Engineer responsible for Dry Etch / PECVD / ALD front-end wafer fabrication. You own process quality, yield, and CpK while driving cross-functional projects with the production, process development, and quality teams.

You will create documentation, set up manufacturing and quality tools, train junior engineers, and lead cost/yield improvement initiatives.

Competenze

  • Bachelor's degree in Engineering or Science.
  • 10 years front-end semiconductor wafer fab experience.
  • Experience leading cross-functional teams.
  • Fluent in English and Bahasa Malaysia.
  • Experience with SPC, FDC and 8D problem solving.

Mansioni

  • In charge of the front-end wafer fabrication process in Dry Etch / PECVD / ALD fields.
  • Own quality, yield, damage containment, process capability and related KPIs.
  • Lead process transfer ramp qualification projects with cross-functional teams.
  • Create and maintain documentation (FMEA, control plans, procedures, etc).
  • Set up and maintain manufacturing/quality tools (SPC, FDC, SAP PM).
  • Provide training to junior engineers and technicians.
  • Lead cross-functional projects on cost/yield/capacity/safety/productivity.

Conoscenze

Cross-functional leadership
Process engineering
Training & mentoring
Documentation
Problem solving

Formazione

Bachelor's degree in Engineering or Science
Master's degree (advantage)
PhD (advantage)

Strumenti

SPC
FDC
SAP PM Scheduling
CIM/EI

Descrizione del lavoro

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.


  • In charge of the elevant front end wafer fabrication process in Dry Etch / PECVD / ALD fields.
  • Full process ownership on quality, yield, damage containment, process capability and stability, cost, CpK and other related KPIs.
  • Lead process transfer ramp qualification projects, cooperate with cross-functional teams (Production, Process Integration, Process Development, Industrial Engineering, Production Planning, Quality Management, EHS, Facility Infrastructure & Hook-up, IT/CIM, Procurement, SCM, Project Management, Regensburg counterparts).
  • Create and maintain documentation (process/maintenance/operation/tool procurement/safety specification and procedures; FMEA; Control Plans; 8D lesson learnt etc)
  • Setup and maintain manufacturing/quality tools (SPC; FDC; SAP PM Scheduling; CIM/EI)
  • Provide training to junior engineers, technicians, manufacturing specialists.
  • Lead/participate in cross-functional projects (cost/yield/capacity/safety/productivity continuous improvement projects)

  • Candidate must have at least a Bachelor's Degree in Engineering or Science. Candidate with Master's Degree or PhD will have an added advantage.
  • 10 years of front-end semiconductor wafer fab working experience & competency in manufacturing, process engineering, product or process development
  • Experienced in leading cross-functional teams (process & equipment engineering, production)
  • Ability to work effectively in cross-cultural multi-national working environment & organization.
  • Experience with SPC, FDC, 8D problem solving, FMEA, DMAIC, TWI and Digital Manufacturing & Automation.
  • Fluent in English and Bahasa Malaysia.
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