Staff Engineer Lead Frame / Packing Material

Infineon Technologies (Malaysia) Sdn Bhd; Malacca City; On-site; MYR 250,000 - 420,000; Full time

Job summary

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Staff Engineer Lead Frame / Packing Materials in its Research & Development team. You will lead technical development for lead frames, substrates, and packing materials, and design to meet manufacturing and cost targets.

The role requires 7+ years in semiconductor packaging, heavy drafting in AutoCAD/Inventor/Cadence, and strong material property knowledge.

Qualifications

• Bachelor’s Degree in Engineering in semiconductor-related fields.
• Minimum 7 years in semiconductor assembly and packaging development.
• Lead frame, substrate, and packing material development and qualification.
• 2D/3D drafting using AutoCAD, Inventor, or Cadence.
• G&D&T and material specification definition.
• Knowledge of packaging, assembly, and test in semiconductors.

Responsibilities

• Serve as the technical expert for lead frame, substrate, and packing material development in package projects.
• Design, draw, and specify lead frames/substrates per guidelines, assembly rules, quality and cost needs.
• Collaborate with internal stakeholders and suppliers on packing materials.
• Drive development activities to meet milestones and release specs and docs.
• Coordinate with SQM and suppliers for quality, FAI, and qualification releases.
• Develop and maintain design guidelines and specifications for lead frames, substrates, packing materials.
• Generate technical papers, journals, and patents related to design.
• Support incoming material quality activities with suppliers and internal teams.
• Participate in roadmapping, UPEG activities, and material selection to meet roadmap needs.
• Engage suppliers to explore new technologies and cost-effective design solutions.

Skills

Analytical skills

Problem solving

Education

Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, or Physics)

Tools

AutoCAD

Inventor

Cadence

Job description

#WeAreIn for jobs that impact everyone's life.

Join the thinkers, builders, and problem-solvers behind tomorrow’s technology.

As a Staff Engineer Lead Frame / Packing Materialin our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

Are you in?

Your role

Key responsibilities in your new role

Serve as the technical expert for lead frame, substrate, and packing material development in package development projects.

Perform design, drawing, and specification development for lead frames and substrates in accordance with design guidelines, assembly rules, and manufacturing, quality, and cost requirements.

Collaborate with internal stakeholders and suppliers on packing material design, specification, and selection to ensure manufacturability, quality, and cost effectiveness.

Drive lead frame, substrate, and packing material development activities to meet project milestones and ensure timely release of specifications, drawings, GIMM, and related documentation.

Coordinate with SQM and suppliers to ensure compliance with quality requirements, FAI completion, and qualification release for lead frames, substrates, and packing materials.

Develop and maintain design guidelines and specification requirements for lead frames, substrates, and packing materials.

Generate technical papers, journals, and patents related to lead frame, substrate, and package design.

Support incoming material quality activities and collaborate with suppliers and internal teams to resolve technical and quality issues and drive improvement initiatives.

Participate in lead frame and packing material technology roadmapping, UPEG activities, and material selection to meet roadmap requirements.

Engage with lead frame, substrate, and packing material suppliers to explore new technologies and cost-competitive design solutions.

Your profile

Qualifications and skills to help you succeed

Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, or Physics).

Minimum 7 years of experience in semiconductor assembly and packaging development, with relevant experience in lead frame and packing material development preferred.

Lead frame, substrate, and packing material development and qualification.

2D/3D lead frame and substrate drafting and design using AutoCAD, Inventor, or Cadence.

Knowledge of lead frame, substrate, and packing material physics and material properties.

GD&T and material specification definition.

Analytical and problem-solving skills.

Semiconductor packaging, assembly, and test knowledge.

Material development, analysis, qualification, and reliability assessment.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization & digitalization. As a global semiconductor leader in power systems & loT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure loT. We make life easier, safer, and greener.

Revenue in fiscal year 2023: more than €16 billion

About 58600 employees worldwide (Sept'23)

69 R&D & 17 manufacturing locations

Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization & digitalization. As a global semiconductor leader in power systems & loT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure loT. We make life easier, safer, and greener.

Revenue in fiscal year 2023: more than €16 billion

About 58600 employees worldwide (Sept'23)