Senior Die Attach Development Engineer – Tech Lead

Infineon Technologies AG; Malacca City; On-site; MYR 80,000 - 120,000; Full time

Job summary

Infineon Technologies AG is looking for a technical leader for their semiconductor operations in Malacca City. This role involves the responsibility for technical handshake, documentation, and supplier liaison to ensure process improvements.

The ideal candidate possesses a Bachelor's or Master's in Engineering, with substantial experience in Die Attach processes and statistical data analysis. Infineon fosters a diverse and inclusive work environment, welcoming diverse applicants.

Qualifications

• 12 years of working experience in the semiconductor industry or other relevant industry.
• Strong hands-on experience in Die Attach processes.
• Knowledge in tooling design and reflow.

Responsibilities

• Responsible for technical handshake and knowledge transfer to Operations.
• Generate and update relevant documents related to processes.
• Liaise with suppliers for continuous improvement.

Skills

Die Attach processes (flipchip, glue, DAF, sintering and reflow)

Mechanical engineering

Statistical data analysis

Analytical and problem-solving skills

Education

Masters/Bachelor's Degree in Engineering

Job description

Infineon Technologies AG is looking for a technical leader for their semiconductor operations in Malacca City. This role involves the responsibility for technical handshake, documentation, and supplier liaison to ensure process improvements.

The ideal candidate possesses a Bachelor's or Master's in Engineering, with substantial experience in Die Attach processes and statistical data analysis. Infineon fosters a diverse and inclusive work environment, welcoming diverse applicants.