Senior Engineer, Process Module Engineering (Material Application Focus)

Sandisk; Simpang Ampat; On-site; MYR 180,000 - 240,000; Full time

Job summary

Sandisk invites a seasoned engineer to join our team in Malaysia to develop SSD assembly and IC packaging materials and processes. You will qualify new SMT materials for NPI, design experiments, and help drive improvements across quality, yield, and cost.

The role spans from pathfinding through ramp to high-volume manufacturing with a strong emphasis on DOE, FA, and metrology knowledge. Qualified candidates bring 8+ years in semiconductor engineering (PhD: 5+ years), strong statistical analysis

Qualifications

• Requires Bachelor/Master/PhD in engineering/material/mechanical/science with at least 8 years of relevant semiconductor industry experience (5 years for PhD).
• Academic record of excellence in engineering/science.

Responsibilities

• Develop SMT material and process for NBM new business model quality, reliability, cost, yield and manufacturing requirements.
• Qualify new SMT materials and packaging processes for NPI programs; identify and mitigate interaction risks.
• Prepare/update specifications for IC/package materials.
• Plan and conduct experiments to characterize materials and processes from pathfinding to ramp.
• Improve quality, reliability, cost, yield, process stability and safety using DOE and statistical tools.
• Establish process control systems and support high volume manufacturing and new factory start-up.
• Coordinate introduction of new package/material processes into production.
• Perform package/material integrity analyses using DOE and FA/stat tools.

Skills

Statistical analysis

DOE design & execution

Minitab/JMP

Excel

Cross-functional collaboration

Education

Bachelor/Master/PhD in engineering/material/mechanical/science

Tools

EDX/FTIR

Failure analysis techniques

Minitab/JMP

Job description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Develops SSD assembly and IC packaging material and processes to meet NBM new business model quality, reliability, cost, yield, productivity and manufacturing requirements.
• Develops new process/packaging material and SMT process qualification for NPI programs, identifying and mitigating all interaction risk in process/material/equipment.
• Prepares and/or updates specifications for piece parts/material of integrated circuits or semiconductor assemblies.
• Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp.
• Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools.
• Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up.
• Coordinates the introduction of new package/material processes into production.
• Using appropriate FA and statistic analytic tools, performs integrity analysis of packages/material from DOE.

PME Specific Role Description

• SMT material and process development
• SMT technology (material/process/metrology/equipment) pathfinding & roadmap
• DFM assessment and NUDD risk management
• Process-Material-Component-board-drive interactions
• DOE & Mechanical and Material Lab Tools & Failure Analysis knowledge
• Quality Tools: FMEA, 8D, DMAIC, IPC knowledge etc.
• Statistical Tools: Statistical analysis (JMP/Minitab), Green Belt/Black Belt certification
• Special engineering characterization & improvement projects
• Factory emergency taskforce support
• SMT AI/ML integration development

Qualifications

PTDI team embodies a high performance culture, marked by highly analytical, attention-to-details, hyper-productive, highly hands-on individuals. They work together to solve difficult problems. They are innovative. They possess the elusive “complete ownership” characteristic and have strong engineering pride, always willing to go above and beyond.

Required

• Bachelor/Master/PhD engineering/material/mechanical/science required plus min 8 years of relevant work experience, min 5 year for PhD. Relevant work experience must be in engineering role within semiconductor industry. Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence.

Preferred

• Demonstrated track record to pathfinding and development new SMT material such as paste and epoxy with vendors and utilizing test methodology to qualify new material in factory.
• Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing thru failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection.
• Demonstrated track record working hands-on around technical equipment and processes (including metrology and semiconductor failure analysis techniques)
• Proficient in statistical analysis towards problem solving and the use of Minitab or JMP and Excel
• Demonstrated track record to summarize complex data sets for technical and non-technical audiences; elegant in DOE design and execution
• Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition
• Proven success leading technical team(s) in previous work experience

Skills

• Track record of qualifying SMT material/PCB/TIM/Enclosure material experience is added advantage.
• Strong technical verbal and written communications skills
• Track record of leading multiple functional engineering and quality groups in achieving common goal of new material introduction.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [e-mail] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.