Senior Failure Analysis Engineer, Memory Packaging

Sandisk; Simpang Ampat; Vor Ort; MYR 60.000 - 90.000; Vollzeit

Zusammenfassung

Sandisk is seeking a detailed-oriented Failure Analysis Engineer in Penang, Malaysia. You will perform detailed electrical and physical package failure analyses on production and test failures, define FA flows, and develop new FA processes for new products and technologies.

You will mentor junior engineers, own FA tools, and expand lab capabilities while collaborating with process, quality, reliability, and product engineering teams to improve product reliability and yield.

Qualifikationen

• Bachelor's or master's in Electrical/Electronic or Materials Eng with strong FA background.
• Experience in failure analysis of memory devices and SEM/EDX or related tools.
• Fluent in technical FA reporting and cross-functional collaboration.

Aufgaben

• Perform detailed electrical and physical package failure analysis on assembly test failures from production, qualification and RMA.

Kenntnisse

Technical writing

Ausbildung

Bachelors/Masters in Electrical & Electronic or Materials Eng

Tools

3D X-ray

CSAM

SEM/EDX

Chemical decapsulation

TDR

Curve tracer

Optical microscopes

FIB

TEM

Jobbeschreibung

Sandisk is seeking a detailed-oriented Failure Analysis Engineer in Penang, Malaysia. You will perform detailed electrical and physical package failure analyses on production and test failures, define FA flows, and develop new FA processes for new products and technologies.

You will mentor junior engineers, own FA tools, and expand lab capabilities while collaborating with process, quality, reliability, and product engineering teams to improve product reliability and yield.