Staff Engineer - IC Packaging & Structural Simulation

Sandisk; Penang; On-site; MYR 120,000 - 210,000; Full time

Job summary

Sandisk is seeking a Mechanical Engineer specialized in IC packaging to influence design for reliability and performance. The role focuses on mechanical aspects, materials interactions, and advanced simulation methods for next-gen semiconductor packages.

The candidate will collaborate with design, characterization, and reliability teams, leveraging expertise in solid mechanics and FE analysis to drive robust packaging solutions and automation.

Qualifications

• Ph.D. in Mechanical Engineering with >3 years of experience.
• M.S. in Mechanical Engineering with >5 years of experience.
• Mechanical engineering of IC packaging and related areas.
• Computational and/or experimental solid mechanics with emphasis on failure analysis.

Responsibilities

• Influence package and product design to address structural integrity and reliability in semiconductor packaging; focus on small form factor with thinner chips and denser interconnects.
• Modeling, simulation, DOE and testing of mechanical responses of IC packages and flash products including SSDs.
• Interface with package & product design, electrical and physical characterization, reliability testing and failure analysis teams.
• Develop in-house structural simulation automation platform using commercial software (e.g. ANSYS, Abaqus).

Skills

Oral and written communication

Work ethic

Global team collaboration

Education

Ph.D. in Mechanical Engineering

M.S. in Mechanical Engineering

Tools

ANSYS

Abaqus

Job description

Sandisk is seeking a Mechanical Engineer specialized in IC packaging to influence design for reliability and performance. The role focuses on mechanical aspects, materials interactions, and advanced simulation methods for next-gen semiconductor packages.

The candidate will collaborate with design, characterization, and reliability teams, leveraging expertise in solid mechanics and FE analysis to drive robust packaging solutions and automation.