Senior Process Engineer (NPI & Wafer Dicing)

Carsem; Ipoh; On-site; MYR 150,000 - 190,000; Full time

Job summary

Carsem in Ipoh, Malaysia is seeking a Senior Process Engineer specializing in NPI and wafer dicing. You will lead the cassette and wafer sawing for new product introductions, optimize blade selection, spindle speed, feed rate and depths to hit yield and quality targets, and drive CAPA-driven improvements.

You will collaborate across Process Eng, Equipment Eng, QA, Production Planning and NPI Program Management to ensure timely delivery, robust documentation, and continuous improvement throughout

Qualifications

• Minimum 5–8 years in semiconductor manufacturing.
• At least 3 years in NPI, wafer sawing/dicing process engineering or similar role.
• Experience with wafer dicing equipment (DISCO, ADT, Synova) preferred.
• Familiarity with DOE, SPC, FMEA, 8D, Six Sigma and statistical analysis.

Responsibilities

• Lead wafer sawing process for NPI projects from evaluation through qualification and release.
• Develop, optimize, and validate sawing process parameters to achieve yield and quality targets.
• Conduct CAPA to resolve wafer-related issues like chipping or yield loss.
• Plan DOE and process characterization to evaluate materials and advanced dicing methods.
• Support equipment qualification and buy-off for new product introductions.
• Collaborate with PFMEA, QA, Production and NPI teams to mitigate risk and ensure timely delivery.
• Prepare SOPs, work instructions, and control plans; monitor OEE, UPH, cycle time, downtime.

Skills

NPI wafer sawing/dicing

Process engineering

DOE & SPC

Root cause analysis

Cross-functional collaboration

Project management

Tools

DISCO

ADT

Synova

Job description

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Senior Process Engineer (NPI & Wafer Dicing)

Lead the wafer sawing process for New Product Introduction (NPI) projects from initial product evaluation through process qualification and production release.

Develop, optimize, and validate wafer sawing process parameters, including blade selection, spindle speed, feed rate, and cutting depth, to achieve targeted yield, quality, and productivity.

Conduct root cause analysis and implement corrective and preventive actions (CAPA) to resolve process issues such as wafer chipping, edge cracking, die shift, and yield loss.

Plan and execute Design of Experiments (DOE) and process characterization activities to evaluate new materials, wafer thicknesses, and advanced dicing technologies, including laser grooving, stealth dicing, and hybrid dicing methods.

Support equipment installation, setup, qualification, and buy-off activities to ensure readiness for new product introduction and compliance with customer specifications.

Collaborate closely with cross-functional teams, including Process Engineering, Equipment Engineering, Quality Assurance, Production Planning, Manufacturing, and NPI Program Management, to ensure timely project execution and risk mitigation.

Prepare, review, and approve process documentation, including Standard Operating Procedures (SOPs), work instructions, process flow documents, FMEA, and Control Plans.

Monitor and analyze key manufacturing performance indicators such as yield, Overall Equipment Effectiveness (OEE), Units Per Hour (UPH), cycle time, and equipment downtime, and drive continuous improvement initiatives.

Ensure compliance with customer requirements, quality standards, and internal manufacturing procedures throughout the NPI lifecycle.

Provide technical guidance and mentoring to junior engineers and technicians while supporting knowledge sharing and capability development within the team.

Strong knowledge of wafer sawing/dicing processes within the semiconductor assembly and test environment.

Experience in New Product Introduction (NPI), process qualification, and production transfer.

Proficient in Design of Experiments (DOE), Statistical Process Control (SPC), Failure Mode and Effects Analysis (FMEA), and root cause analysis methodologies (8D, Fishbone, 5 Why).

Knowledge of semiconductor packaging, SMT processes, and manufacturing process control is an advantage.

Familiarity with wafer dicing equipment, tooling, and process optimization techniques.

Strong analytical, problem-solving, and troubleshooting skills.

Excellent cross-functional collaboration and stakeholder management abilities.

Good project management, communication, and presentation skills.

Ability to work independently in a fast-paced manufacturing environment while managing multiple NPI projects simultaneously.

Experience Requirement

Minimum 5-8 years of experience in semiconductor manufacturing.

At least 3 years in NPI, wafer sawing/dicing process engineering, or a similar technical role.

Experience with wafer dicing equipment (e.g., DISCO, ADT, Synova) is highly preferred.

Familiarity with DOE, SPC, FMEA, 8D, Six Sigma, and statistical process analysis.