Dicing Engineer – Semiconductor Manufacturing

Globetronics Technology Berhad; Bayan Lepas; On-site; MYR 60,000 - 95,000; Full time

Job summary

Globetronics Technology Berhad in Bayan Lepas, Penang, is seeking a Dicing Process Engineer to lead wafer dicing/sawing process development and optimization for semiconductor manufacturing. The role includes process qualification, DOE, SPC, and yield improvement to support production and NPI.

You will work with Equipment, Production, QA, and NPI teams to resolve issues, ensure specifications, and drive projects that improve yield, quality, cost, and productivity.

Qualifications

• 2–5 years of relevant experience in semiconductor manufacturing.
• Hands-on experience with dicing/sawing processes and equipment.
• Knowledge of DOE, SPC, and yield improvement.

Responsibilities

• Develop, establish, and optimize wafer dicing/sawing processes to meet product quality and yield requirements.
• Set up and optimize dicing process parameters including spindle speed, cutting speed, blade selection, feed rate, cooling water, and cut depth.
• Perform process trials, DOE, qualification, and validation for new and existing products.
• Support NPI, engineering builds, product transfer, and new process introduction.
• Drive continuous improvement using SPC and other quality tools.

Skills

Dicing/sawing processes

Analytical thinking

Troubleshooting

Cross-functional teamwork

Education

Bachelor's degree in Mechanical, Electrical & Electronic, Mechatronics, Manufacturing, Materials Engineering

Tools

DISCO wafer dicing equipment

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Dicing Engineer – Semiconductor Manufacturing

Job Summary

We are looking for an experienced Dicing Process Engineer to join our semiconductor manufacturing team in Bayan Lepas, Penang. The successful candidate will be responsible for dicing process development, optimization, troubleshooting, yield improvement, and equipment/process qualification to support production and new product introduction.

Key Responsibilities

• Develop, establish, and optimize wafer dicing/sawing processes to meet product quality and yield requirements.
• Set up and optimize dicing process parameters, including spindle speed, cutting speed, blade selection, feed rate, cooling water, and cut depth.
• Monitor and improve process performance, yield, cycle time, and productivity.
• Troubleshoot dicing-related defects such as chipping, cracking, burrs, delamination, incomplete cuts, and die damage.
• Conduct process trials, DOE, process qualification, and validation for new and existing products.
• Support NPI, engineering builds, product transfer, and new process introduction.
• Perform root cause analysis and implement corrective and preventive actions for process issues.
• Analyze process data and drive continuous improvement using SPC and other quality tools.
• Work closely with Equipment, Production, QA, and NPI teams to resolve process and quality issues.
• Develop and maintain process specifications, work instructions, control plans, FMEA, and other engineering documentation.
• Support machine setup, equipment qualification, preventive maintenance, and process capability improvement.
• Drive projects to improve yield, quality, cost, and production efficiency.
• Ensure compliance with ESD, safety, quality, and manufacturing requirements.

Requirements

• Bachelor's Degree in Mechanical, Electrical & Electronic, Mechatronics, Manufacturing, Materials Engineering, or related field.
• 2–5 years of relevant experience in semiconductor manufacturing, preferably in wafer dicing/sawing processes.
• Strong hands-on knowledge of dicing/sawing process and equipment.
• Experience in process optimization, troubleshooting, DOE, SPC, and yield improvement.
• Good understanding of wafer, blade, cutting, and die handling processes.
• Strong analytical and problem-solving skills.
• Good communication and cross-functional teamwork skills.
• Able to work independently in a fast-paced manufacturing environment.
• Willing to work in a semiconductor production environment and support shift or extended hours when required.

Preferred Skills

• Experience with DISCO or similar wafer dicing equipment.
• Knowledge of semiconductor wafer processing and assembly.
• Experience with blade selection, dressing, spindle maintenance, and cutting parameter optimization.
• Knowledge of SPC, FMEA, Control Plan, 8D, DOE, and RCA.
• Experience in yield improvement and defect reduction projects.Experience supporting NPI and customer/product qualification activities.