Senior Manager, IC Packaging & High-Volume Assembly

Renesaselectronics

Hang Tuah Jaya

On-site

MYR 250,000 - 380,000

Full time

2 days ago

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Job summary

Renesaselectronics seeks an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to lead sustaining engineering and high-volume manufacturing for advanced packaging technologies, including AI/data center power packaging and wide-bandgap materials such as SiC and GaN.

The role focuses on yield, process stability, quality control, and manufacturing readiness, while partnering with Package Engineering, R&D, Quality, Supply Chain, and OSAT partners to transition NPI programs

Qualifications

Bachelor's degree in Electrical Engineering.

Responsibilities

Support sustaining engineering across semiconductor package assembly technologies and product lines.
Execute high-volume manufacturing improvement activities related to yield, cycle time, quality, throughput, and cost.
Develop and maintain engineering practices for process control, defect reduction, and continuous improvement.
Contribute technical input to assembly engineering roadmaps aligned with package technology and business needs.
Work with Package Engineering and OSAT teams to ensure manufacturable designs and robust production controls.
Monitor assembly yield performance, trends, and corrective action progress.