Senior Manager, Advanced IC Packaging & HVM

Renesaselectronics

Shah Alam

On-site

MYR 300,000 - 520,000

Full time

2 days ago

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Job summary

Renesaselectronics is seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to drive sustaining engineering and high-volume manufacturing for advanced packaging technologies, including AI/data center power packaging applications and WBG devices. You will partner with Package Engineering, R&D, Quality, and Supply Chain to transition NPI programs into scalable production.

The role emphasizes yield performance, process stability, quality control, change

Qualifications

Bachelor's degree in Electrical Engineering (minimum).

Responsibilities

Support sustaining engineering across semiconductor package assembly technologies and product lines.
Execute high-volume manufacturing improvement activities related to yield, cycle time, quality, throughput, and cost.
Develop and maintain engineering practices for process control, defect reduction, and continuous improvement.
Contribute technical input to assembly engineering roadmaps aligned with package technology and business needs.