Senior Manager, Advanced Semiconductor Packaging & HVM

Renesas Electronics Corp.; Shah Alam; On-site; MYR 180,000 - 240,000; Full time

Job summary

Renesas Electronics Corp. seeks a Senior Manager of Semiconductor IC Packaging Assembly Engineering to lead sustaining and ramping of high-volume manufacturing for advanced packaging technologies across global sites.

The role emphasizes yield, quality, process control, and cross-functional execution with OSAT partners. The ideal candidate will combine deep packaging assembly expertise with data-driven problem solving and strong collaboration to improve manufacturing performance, product quality,

Qualifications

• Bachelor’s degree in a technical discipline is required.
• 15+ years of semiconductor manufacturing and packaging engineering experience.
• 3+ years of leading technical projects or managing small teams.
• Strong expertise in IC package assembly processes and related qualification methods.
• Experience with global OSAT partners and NPI-to-HVM ramps.

Responsibilities

• Support sustaining engineering across semiconductor package assembly technologies and product lines.
• Drive high-volume manufacturing improvement in yield, cycle time, quality, throughput, and cost.
• Maintain process control, defect reduction, and continuous improvement practices.
• Collaborate with Package Engineering, R&D, Quality, Supply Chain and OSAT partners to enable scalable production.
• Monitor yield performance and lead data-driven improvement initiatives.
• Support containment and corrective actions for quality issues and audits.
• Lead process change management and qualification plans for transfers and cost reductions.
• Act as interface for NPI-to-production transfers and ramp readiness.
• Coordinate with OSAT partners on transfers, benchmarking, and scaling.

Education

Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline

Job description

Renesas Electronics Corp. seeks a Senior Manager of Semiconductor IC Packaging Assembly Engineering to lead sustaining and ramping of high-volume manufacturing for advanced packaging technologies across global sites.

The role emphasizes yield, quality, process control, and cross-functional execution with OSAT partners. The ideal candidate will combine deep packaging assembly expertise with data-driven problem solving and strong collaboration to improve manufacturing performance, product quality,