Senior FA & REL Engineer (Failure Analysis & Reliability)

TF AMD MICROELECTRONICS (PENANG) SDN. BHD.; Penang; On-site; MYR 120,000 - 240,000; Full time

Benefits offered by this job

Medical Miscellaneous allowance

Education support

Dental Parking

Sports (e.g. Gym)

Vision Insurance coverage

Vehicle Interest Subsidy

Job summary

TF AMD Microelectronics (Penang) Sdn. Bhd. seeks a Senior Failure Analysis Engineer to identify and resolve complex electrical and electronic challenges across development and production.

Based in Penang (Batu Kawan), you will work on cutting‑edge semiconductor technology and contribute to ongoing success. You will conduct RCA using SEM, FIB, X‑Ray and other FA tools, mentor junior engineers, and drive CAPA with Design, Process, Product, Manufacturing and Test teams, while ensuring strict safety

Qualifications

• Bachelor’s or Master’s Degree in Electrical, Electronics, Materials, Mechanical Engineering or related field.
• Minimum 8 years of experience in semiconductor FA/REL, backend manufacturing, or advanced packaging.
• Hands‑on experience with FA tools (SEM, FIB, TDR, CSAM, X‑Ray, grinding, wet etch, etc.) and REL tester.
• Experience supporting high‑volume manufacturing and key customer accounts.
• Proven leadership in managing technical teams and complex escalations.
• Advanced analytical and problem‑solving skills
• Customer‑focused with excellent communication skills
• Ability to perform under pressure in fast‑paced manufacturing environments

Responsibilities

• Perform comprehensive failure analysis on semiconductor devices, advanced packages, or electronic systems across development and production stages
• Plan and execute electrical, physical, and material analyses using advanced FA techniques
• Independently conduct root cause analysis (RCA) and document data-driven conclusions
• Utilize FA tools such as SEM, FIB, EDX, lock-in thermography, X‑Ray, and probing techniques
• Interpret schematics, layouts, and test data to correlate failure mechanisms
• Support customer complaints, reliability issues, and qualification failures with timely FA reports
• Drive CAPA with cross-functional teams (Design, Process, Product, Manufacturing, Test)
• Develop and improve FA methodologies, best practices, and lab capabilities
• Mentor junior FA engineers and provide technical guidance as needed
• Ensure compliance with lab safety, quality, and documentation standards
• Nice to Have: Experience in Bumping, Wafer Level, Advanced packaging
• Familiar with OSAT or foundry environments
• Exposure to global customers
• Experience working with advanced lab analytical tools and techniques

Skills

FA leadership

Analytical thinking

Customer communication

High-volume manufacturing

Problem solving

Education

Bachelor’s or Master’s Degree in Electrical/Electronics/Materials/Mechanical Engineering

Tools

SEM

FIB

TDR

CSAM

X-Ray

Probing

Job description

About the role

As a Senior Failure Analysis Engineer at TF AMD MICROELECTRONICS (PENANG) SDN. BHD., you will play a crucial role in identifying and resolving complex electrical and electronic engineering challenges. This full-time position is based in Penang (Batu Kawan) and offers the opportunity to work on cutting‑edge technology and contribute to the company's continued success.

What you'll be doing:

• Perform comprehensive failure analysis on semiconductor devices, advanced packages, or electronic systems across development and production stages


• Plan and execute electrical, physical, and material analyses using advanced FA techniques


• Independently conduct root cause analysis (RCA) and document clear, data‑driven conclusions


• Utilize FA tools such as SEM, FIB, EDX, lock‑in thermography, X‑Ray, and probing techniques


• Interpret schematics, layouts, and test data to correlate failure mechanisms


• Support customer complaints, reliability issues, and qualification failures with timely and high‑quality FA reports


• Drive corrective and preventive actions (CAPA) with cross‑functional teams (Design, Process, Product, Manufacturing, Test)


• Develop and improve FA methodologies, best practices, and lab capabilities


• Mentor junior FA engineers and provide technical guidance as needed


• Ensure compliance with lab safety, quality, and documentation standards

Job Requirements:

• Bachelor’s or Master’s Degree in Electrical, Electronics, Materials, Mechanical Engineering, or related field.


• Minimum 8 years of experience in semiconductor FA/ REL, backend manufacturing, or advanced packaging.


• Strong knowledge of failure physics, material interactions, and assembly processes.


• Hands‑on experience with FA tools (SEM, FIB, TDR, CSAM, X‑Ray, grinding, wet etch, etc.) and REL tester.


• Experience supporting high‑volume manufacturing and key customer accounts.


• Proven leadership in managing technical teams and complex escalations.


• Advanced analytical and problem‑solving skills


• Customer‑focused with excellent communication skills


• Ability to perform under pressure in fast‑paced manufacturing environments

Nice to Have:

• Experience in Bumping, Wafer Level, Advanced packaging


• Exposure to OSAT or foundry environments


• Experience working with global customers


• Familiar with advanced lab analytical tool and techniques

Consumer Electronics Manufacturing 1,001-5,000 employees

Unleash your potential with the advanced leading‑edge semiconductor and ground breaking technology company - TF AMD

TF AMD Microelectronics (Penang) Sdn. Bhd., the 1st company in the world to assemble and test the leading microprocessor. The remarkable world class assembly and test Multichip Module (MCM) microprocessor has been successfully manufactured at TF AMD since 2019.

Our Core Business in Assembly and Test Microprocessors. Graphics Processors and Gaming Consoles. TF AMD has advanced facilities and technology with ground breaking dominant to develop top cutting‑edge technologies that push the boundaries of what’s possible throughout the major assembly and test plant.

Unleash your potential with the advanced leading‑edge semiconductor and ground breaking technology company - TF AMD

TF AMD Microelectronics (Penang) Sdn. Bhd., the 1st company in the world to assemble and test the leading microprocessor. The remarkable world class assembly and test Multichip Module (MCM) microprocessor has been successfully manufactured at TF AMD since 2019.

Our Core Business in Assembly and Test Microprocessors. Graphics Processors and Gaming Consoles. TF AMD has advanced facilities and technology with ground breaking dominant to develop top cutting‑edge technologies that push the boundaries of what’s possible throughout the major assembly and test plant.

Perks and benefits

• Medical Miscellaneous allowance


• Education support


• Dental Parking


• Sports (e.g. Gym)


• Vision Insurance coverage


• Vehicle Interest Subsidy

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What can I earn as a Failure Analysis Engineer